HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E
Tech industryHBMMemoryMicronSamsungSK hynix
The race began with SK hynix and Micron moving HBM3E into volume production in 2024, while Samsung sampled a 12-layer HBM3E but later positioned its HBM4 launch as its return to Nvidia’s supply chain. JEDEC published the HBM4 standard in April 2025, but Nvidia’s later Rubin specification change pushed the expected industry ramp into early 2026. Samsung, Micron and SK hynix each reported HBM4 shipments in 2026; Samsung and SK hynix have now sampled HBM4E, while Micron targets HBM4E volume production in 2027. Supply is increasingly committed in advance—Micron has contracted most of its 2027 HBM bits at higher prices—while the remaining questions are how quickly HBM4E qualifies at customers and whether packaging and manufacturing capacity can keep up.
Key moments
- Feb 27, 2024Samsung develops the first 12-high 36GB HBM3E, mass production planned for the first half of 2024
- Mar 19, 2024SK hynix begins volume production of HBM3E, supplying a customer from late March
- Mar 19, 2025SK hynix ships the first 12-layer HBM4 samples, targets mass-production readiness in the second half of 2025
- Apr 16, 2025JEDEC publishes the HBM4 standard, doubling channels per stack to 32
- Jan 8, 2026TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec
- Feb 12, 2026Samsung begins HBM4 mass production and commercial shipments, expects HBM sales to more than triple in 2026
- Mar 16, 2026Micron in volume shipment of HBM4 for Nvidia Vera Rubin
- May 29, 2026Samsung ships the first 12-layer HBM4E samples at up to 16 Gbps
- Jun 18, 2026SK hynix ships 12-layer HBM4E samples to major customers
- Jun 24, 2026Micron expects HBM4E volume production in 2027
- Aug 27, 2026SK hynix breaks ground on the Indiana HBM packaging plant, now over US$4 billion with production in 2029
- Sep 30, 2026Micron contracts most of its 2027 HBM bit supply
Timeline
Earlier years show only their entries' dates and titles. Click a year heading to show the details.
202625 entries
- Financial
Samsung's quarterly operating profit passes 100 trillion won for the first time, on HBM4
Samsung Electronics' preliminary third-quarter 2026 guidance put consolidated operating profit at about 107.4 trillion won, up 782.5 percent year on year, and revenue at about 195 trillion won, up 126.6 percent. TrendForce reported it as a record quarter in which operating profit crossed 100 trillion won for the first time and beat the LSEG SmartEstimate of 106.1 trillion won. It said HBM4 sales began making a meaningful contribution during the quarter, driven by demand for Nvidia's Vera Rubin accelerator, and cited Reuters for Samsung's HBM bit shipments jumping nearly 50 percent quarter on quarter.
- TrendForce · Oct 8, 2026 ·
consolidated operating profit soared 782.5% year over year to KRW 107.4 trillion, while revenue jumped 126.6% to KRW 195 trillion.
- TrendForce · Oct 8, 2026 ·
Fueled by strong HBM4 demand, Samsung’s HBM bit shipments reportedly jumped nearly 50% quarter over quarter in the third quarter, according to Reuters.
Editor's note: Repaired in review: the two Samsung newsroom citations return no readable text to the fetcher, so the quotes attributed to them could not be checked and a reader following them would see nothing. TrendForce carries every figure in the entry, including the ones the Samsung pages were cited for.
- TrendForce · Oct 8, 2026 ·
- Financial
Micron forecasts HBM bit shipments will outgrow conventional DRAM
Micron forecast industry HBM bit shipments would grow faster than conventional DRAM through calendar 2028. Reuters reported that Micron expected memory and storage supply and demand conditions to be tighter in fiscal 2027 and 2028 than in 2026.
- Stock Analysis · Sep 30, 2026 ·
“We expect industry HBM bit shipments to grow faster than conventional DRAM through calendar 2028.”
- Reuters · Sep 30, 2026 ·
“The company expects memory and storage supply and demand conditions to be much tighter in fiscal 2027 and 2028 compared with 2026, the CEO said.”
Editor's note: The transcript is dated September 30, 2026 and explicitly states that industry HBM bit shipments are expected to grow faster than conventional DRAM through calendar 2028. It also says memory and storage supply-demand conditions are expected to be much tighter in fiscal 2027 and 2028 than in 2026.
- Stock Analysis · Sep 30, 2026 ·
- Update
Micron says Singapore HBM packaging preparation is ahead of plan
Micron said clean-room preparation at its Singapore HBM advanced-packaging facility was ahead of plan. It expected initial output in early calendar 2027.
- Stock Analysis · Sep 30, 2026 ·
“In Singapore, clean room preparation is ahead of plan at our HBM advanced packaging facility, with initial output expected in early calendar 2027.”
Editor's note: The transcript states that Singapore clean-room preparation at Micron's HBM advanced-packaging facility is ahead of plan and that initial output is expected in early calendar 2027. The page identifies the earnings call date as September 30, 2026.
- Stock Analysis · Sep 30, 2026 ·
- Announcement
Micron says it is working with NVIDIA on NV-HBM
Micron said it was working with NVIDIA on NV-HBM. Micron described NV-HBM as a custom HBM4E implementation for next-generation GPUs and NVLink Fusion platforms.
- Stock Analysis · Sep 30, 2026 ·
“We have a strong roadmap for future HBM products and are proud to be working with NVIDIA on the industry's first custom HBM4E implementation, NV-HBM, to be adopted on next generation of GPUs and NVLink Fusion platforms.”
Editor's note: The transcript states that Micron is working with NVIDIA on NV-HBM, described as the industry's first custom HBM4E implementation for next-generation GPUs and NVLink Fusion platforms. The page identifies the Q4 2026 earnings call date as 2026-09-30.
- Stock Analysis · Sep 30, 2026 ·
- FinancialKey moment
Micron contracts most of its 2027 HBM bit supply
Micron said it had completed agreements for the vast majority of its calendar-2027 HBM bit supply, with significant year-over-year price increases that narrow the gross-margin gap with conventional DRAM.
- Micron Technology, Inc. · Sep 30, 2026 ·
We have completed agreements for the vast majority of our calendar 2027 HBM bit supply with significant price increases year over year, narrowing the gross margin gap with conventional DRAM.
- Stock Analysis · Sep 30, 2026 ·
“We have completed agreements for the vast majority of our calendar 2027 HBM bit supply with significant price increases year-over-year, narrowing the gross margin gap with conventional DRAM.”
- Reuters · Sep 30, 2026 ·
“Mehrotra also said that Micron has secured agreements for most of its 2027 high-bandwidth memory output and will increase fiscal 2027 capital spending above prior plans to add capacity.”
Editor's note: Editor: dropped a Reuters attribution and a capital-spending claim the transcript does not carry in that form. Official source added: https://investors.micron.com/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf
- Micron Technology, Inc. · Sep 30, 2026 ·
- Report
TrendForce says GPU and ASIC makers consider lower HBM capacity
TrendForce reported that GPU and ASIC manufacturers were considering reducing HBM capacity per device. The report described this consideration as a reduction in HBM capacity per device.
- TrendForce · Sep 29, 2026 ·
“TrendForce reports that GPU and ASIC manufacturers are now considering reducing HBM capacity per device.”
Editor's note: The page states that GPU and ASIC manufacturers are considering reducing HBM capacity per device. It is dated 29 September 2026, matching the node date.
- TrendForce · Sep 29, 2026 ·
- Report
TrendForce forecasts 121% growth in 2027 blended HBM ASP
TrendForce projected blended HBM ASP would increase 121% year over year. The projection concerned blended HBM ASP.
- TrendForce · Sep 29, 2026 ·
“Blended ASP is now projected to jump 121% YoY.”
Editor's note: The page states that TrendForce raised its 2027 HBM price outlook and that "Blended ASP is now projected to jump 121% YoY." It is dated 29 September 2026.
- TrendForce · Sep 29, 2026 ·
- Update
SK hynix displays NVIDIA Vera Rubin with 36GB HBM4
SK hynix displayed NVIDIA's Vera Rubin superchip. The superchip was equipped with SK hynix's 12-layer 36GB HBM4 and 96GB SOCAMM2.
- SK hynix Newsroom · Sep 28, 2026 ·
“NVIDIA’s superchip ‘Vera Rubin,’ equipped with SK hynix’s 12-layer 36GB HBM4 and 96GB SOCAMM2”
Editor's note: The page states that NVIDIA’s Vera Rubin superchip was displayed with SK hynix’s 12-layer 36GB HBM4 and 96GB SOCAMM2. It says the conference was held on the 23rd local time, but does not provide a month or full event date in the readable text.
- SK hynix Newsroom · Sep 28, 2026 ·
- Report
Report says Samsung reviews 4nm capacity expansion for HBM4 base dies
MoneyToday reported that Samsung Electronics was reviewing an expansion of its 4nm foundry-process capacity. The report said the review was to meet growing demand for HBM4 base dies.
- MoneyToday · Sep 22, 2026 ·
According to the electronics industry on the 21st, Samsung Electronics is reviewing an expansion of its foundry 4nm process capacity to meet the growing demand for HBM4 base dies.
Editor's note: The page states that, according to the electronics industry on the 21st, Samsung Electronics was reviewing expansion of foundry 4nm-process capacity to meet growing HBM4 base-die demand. The quoted sentence appears on the page.
- MoneyToday · Sep 22, 2026 ·
- Report
Report expects Samsung to more than double HBM4-family output in 2027
Seoul Economic Daily reported that Samsung Electronics was expected to more than double output of its HBM4-family chips in 2027. The report included HBM4 and HBM4E in that expectation.
- Seoul Economic Daily · Sep 20, 2026 ·
Samsung Electronics (005930) is expected to more than double output of its HBM4 family of high-bandwidth memory chips next year, including sixth-generation HBM4 and seventh-generation HBM4E, as the company plans to raise demand for glass carriers by 2.5 times from this year.
Editor's note: The page states that Samsung is expected to more than double HBM4-family output next year, including HBM4 and HBM4E. It attributes the information to industry sources on September 20, 2026.
- Seoul Economic Daily · Sep 20, 2026 ·
- Report
Report says Samsung HBM4 yield rose to about 80%
Seoul Economic Daily reported that Samsung's HBM4 yield was below 60% in the early stages of mass production. The report said the yield had recently climbed to around 80%.
- Seoul Economic Daily · Sep 20, 2026 ·
According to industry sources on the 20th, Samsung's HBM4 yield was below 60% in the early stages of mass production but has recently climbed to around 80%.
Editor's note: The page states that Samsung's HBM4 yield was below 60% in early mass production and had recently risen to around 80%, matching the summary and quote. It attributes the information to industry sources on the 20th, consistent with the stated 2026-09-20 event date.
- Seoul Economic Daily · Sep 20, 2026 ·
- Report
Samsung directs DDR5 and SSD capacity growth to external firms
TechRadar reported that Samsung was directing capacity growth for DDR5 modules and SSDs to external firms. The report said Samsung was reserving in-house capacity for HBM packaging.
- TechRadar · Sep 19, 2026 ·
The company is directing capacity growth for DDR5 modules and SSDs toward external firms, reserving its in-house capacity for the more advanced HBM packaging process.
Editor's note: The page explicitly states that Samsung is directing DDR5 and SSD capacity growth to external firms while reserving in-house capacity for advanced HBM packaging. However, the readable page text does not provide an event or publication date supporting 2026-09-19.
- TechRadar · Sep 19, 2026 ·
- Response
SK hynix says no U.S. memory-production plan or arrangement is finalized
SK hynix said it was exploring options to strengthen its global competitiveness. It said no specific plans or arrangements had been finalized.
- SK hynix Newsroom · Sep 16, 2026 ·
“SK hynix is exploring various options to strengthen its global competitiveness, but no specific plans or arrangements have been finalized at this time.”
responded to Reuters reports SK hynix and Intel held U.S. memory manufacturing talks. responded to Reuters reports possible SK hynix use of Intel's Ohio facility on Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake.
Editor's note: The page states that SK hynix is exploring options to strengthen global competitiveness and that no specific plans or arrangements have been finalized. It identifies the related report as published on September 16, 2026, supporting the node date.
- SK hynix Newsroom · Sep 16, 2026 ·
- Report
Reuters reports SK hynix and Intel held U.S. memory manufacturing talks
Reuters reported that SK hynix was holding exploratory discussions with Intel about manufacturing memory chips in the United States. One potential scenario was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.
- Reuters (via Investing.com) · Sep 16, 2026 ·
“Under one potential scenario, SK Hynix would lease part of Intel’s long-planned chipmaking facility in Ohio, they said.”
- Tom’s Hardware · Sep 16, 2026 ·
“South Korean memory chip manufacturer SK hynix is in talks with Intel to start manufacturing inside the U.S., according to Reuters.”
was answered by SK hynix says no U.S. memory-production plan or arrangement is finalized. was answered by SK hynix says no decision has been made on reported Intel scenarios on Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake.
Editor's note: The page is a Reuters report published September 16, 2026 and states that SK Hynix was in exploratory talks with Intel about manufacturing memory chips in the United States. It explicitly describes the potential Ohio-facility lease scenario in the quoted language.
- Reuters (via Investing.com) · Sep 16, 2026 ·
- Report
TrendForce links Samsung's Q2 shipment growth to HBM4 ramp
TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.
- TrendForce · Sep 7, 2026 ·
TrendForce notes that Samsung posted the strongest QoQ bit shipment growth among the three major suppliers in 2Q26, supported by its early move into HBM4 mass production and shipments.
Editor's note: The page is readable and states that Samsung had the strongest QoQ bit-shipment growth among the three major suppliers in 2Q26, supported by early HBM4 mass production and shipments. It was published on 2026-09-07, matching the node date.
- TrendForce · Sep 7, 2026 ·
- Report
Electronic Times reports Micron began 12-layer HBM4 mass production in Q2
Electronic Times reported that Micron began mass production of 12-layer HBM4 products in the second quarter of 2026. The report identified the products as 12-layer HBM4. The same report said Micron plans to add up to 60,000 wafers a month of HBM capacity by the end of 2026.
- Electronic Times · Sep 4, 2026 ·
Micron began mass production of 12-layer HBM4 products in the second quarter of this year.
contradicts Micron in volume shipment of HBM4 for Nvidia Vera Rubin.
Editor's note: The page states that Micron began mass production of 12-layer HBM4 products in the second quarter of this year. It was published on 2026-09-04, so the stated event timing is supported as Q2 2026.
- Electronic Times · Sep 4, 2026 ·
- AnnouncementKey moment
SK hynix breaks ground on the Indiana HBM packaging plant, now over US$4 billion with production in 2029
SK hynix held the groundbreaking ceremony for its West Lafayette, Indiana advanced packaging plant at Purdue University. The expected investment rose to over US$4 billion, the cleanroom is due by October 2028 and mass production of next-generation HBM in the second half of 2029, a year later than the 2028 target given in April 2024.
- SK hynix Newsroom · Aug 28, 2026 ·
The Indiana fab, with a total expected investment of over $4 billion, is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029.
contradicts SK hynix commits US$3.87 billion to an HBM packaging plant in Indiana.
Editor's note: Quotes confirmed on the SK hynix newsroom release dated August 28, 2026; the ceremony was on the 27th local time.
- SK hynix Newsroom · Aug 28, 2026 ·
- Shipment
SK hynix says it began mass shipments of HBM4 in Q2 2026
SK hynix said it began mass shipments of HBM4 in the second quarter of 2026. It said it would ramp production in the second half of the year.
- SK hynix · Jul 29, 2026 ·
The company began mass shipments of HBM4 in the second quarter and will ramp up production in the second half of the year.
Editor's note: The page states that SK hynix began mass shipments of HBM4 in the second quarter and would ramp up production in the second half of 2026. The release is dated July 29, 2026.
- SK hynix · Jul 29, 2026 ·
- FinancialKey moment
Micron expects HBM4E volume production in 2027
Micron said development of HBM4E using 1-gamma DRAM technology was underway. The company said it expected volume production in calendar 2027.
- Micron · Jun 24, 2026 ·
Development of HBM4E, built on 1-gamma DRAM technology, is well underway, with volume production expected in calendar 2027.
Editor's note: The page, published June 24, 2026, states that development of HBM4E built on 1-gamma DRAM technology is well underway and that volume production is expected in calendar 2027.
- Micron · Jun 24, 2026 ·
- ShipmentKey moment
SK hynix ships 12-layer HBM4E samples to major customers
SK hynix announced that it had shipped HBM4E samples to major customers. The samples were for a 12-layer HBM4E product.
- SK hynix · Jun 18, 2026 ·
SK hynix announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.
Editor's note: The page states that SK hynix shipped HBM4E samples to major customers and specifies that the samples were of a 12-stack (12-layer) HBM4E product. It is dated June 18, 2026, and the quoted sentence appears on the page.
- SK hynix · Jun 18, 2026 ·
- AnnouncementKey moment
Samsung ships the first 12-layer HBM4E samples at up to 16 Gbps
Image: Samsung Electronics · source Samsung said it had begun shipping 12-layer HBM4E samples to major customers, reaching up to 16 Gbps with better energy efficiency and thermals, extending its roadmap after the HBM4 mass production earlier in the year.
- Samsung Semiconductor · May 29, 2026 ·
Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market.
- Samsung Semiconductor · May 29, 2026 ·
- Announcement
Samsung shows HBM4 in mass production for Vera Rubin and unveils HBM4E at GTC 2026
Image: Samsung Electronics · source At Nvidia's GTC 2026 Samsung made its sixth-generation HBM4, in mass production and designed for the Vera Rubin platform, the centerpiece of its showcase and unveiled HBM4E, positioning itself as a Nvidia supplier after missing the first HBM3E wave.
- Samsung Semiconductor · Mar 16, 2026 ·
The centerpiece of Samsung’s showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform.
- Samsung Semiconductor · Mar 16, 2026 ·
- LaunchKey moment
Micron in volume shipment of HBM4 for Nvidia Vera Rubin
Micron said it had begun volume shipment of HBM4 36GB 12-high in the first quarter of calendar 2026, designed for Nvidia's Vera Rubin platform, with a 2048-bit interface above 11 Gbps and more than 2.8 TB/s per stack.
- Micron Investor Relations · Mar 16, 2026 ·
Micron Technology, Inc. (Nasdaq: MU), has begun volume shipment of its HBM4 36GB 12H in the first quarter of calendar year 2026
is contradicted by Electronic Times reports Micron began 12-layer HBM4 mass production in Q2.
- Micron Investor Relations · Mar 16, 2026 ·
- LaunchKey moment
Samsung begins HBM4 mass production and commercial shipments, expects HBM sales to more than triple in 2026
Image: Samsung Electronics · source Samsung announced mass production and commercial shipment of HBM4 running at 11.7 Gbps and capable of up to 13 Gbps, on a 4nm logic base die, and said it expected its HBM sales to more than triple in 2026 while expanding HBM4 capacity. It was Samsung's first claim of an HBM generation lead over SK hynix.
- Samsung Semiconductor · Feb 12, 2026 ·
Samsung anticipates that its HBM sales will more than triple in 2026 compared to 2025, and is proactively expanding its HBM4 production capacity.
- Samsung Global Newsroom · Feb 12, 2026 ·
Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers.
Editor's note: Date from the Samsung Global Newsroom post (meta date 2026-02-12T15:00+09:00), checked in the editor's browser; the Samsung Semiconductor mirror carries a later modification date.
- Samsung Semiconductor · Feb 12, 2026 ·
- ReportKey moment
TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec
TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of 2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin speed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand led Nvidia to adjust the Rubin production timeline.
- TrendForce · Jan 8, 2026 ·
Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This change has necessitated that the three major HBM suppliers modify their designs.
contradicts SK hynix completes HBM4 development and says its mass-production system is ready. result of Nvidia discloses a Blackwell mask change to improve yields on its Q2 FY2025 call on Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin. is contradicted by NVIDIA says its roadmap is intact on Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin.
- TrendForce · Jan 8, 2026 ·
20259 entries
- Financial
Micron completes 2026 HBM price-and-volume agreements
Micron said it had completed price-and-volume agreements for its entire calendar-2026 HBM supply. The agreements included its HBM4 supply.
- The Motley Fool (Micron Q1 FY2026 earnings call transcript) · Dec 17, 2025 ·
We have completed agreements on price and volume for our entire calendar 2026 HBM supply, including Micron's industry-leading HBM4.
Editor's note: The page states that Micron had completed agreements on price and volume for its entire calendar-2026 HBM supply, including HBM4. The page is dated Dec. 17, 2025.
- The Motley Fool (Micron Q1 FY2026 earnings call transcript) · Dec 17, 2025 ·
- Report
Counterpoint reports SK hynix and Samsung held 79% of Q2 HBM shipments
Counterpoint Research reported that SK hynix held 62% and Samsung Electronics held 17% of global HBM shipment share in the second quarter of 2025. The reported combined share was about 79%.
- Counterpoint Research ·
2025년 2분기 전세계 HBM 시장에서 SK하이닉스와 삼성전자가 출하량 기준 점유율 62%, 17%를 기록하며, 이로써 K-HBM이 전체 시장의 약 79% 차지
Editor's note: Date corrected from 2025-06 to 2025-09-24. The page explicitly states that SK hynix and Samsung Electronics held 62% and 17%, respectively, of global Q2 2025 HBM shipments, totaling about 79%. However, the article was published on 2025-09-24, not in 2025-06.
- Counterpoint Research ·
- Announcement
SK hynix completes HBM4 development and says its mass-production system is ready
SK hynix announced it had completed HBM4 development and finished preparing mass production, the first supplier to claim both, on the schedule it set in March.
- SK hynix Newsroom · Sep 12, 2025 ·
SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high performance AI, mass production for the world's first time.
is contradicted by TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec.
- SK hynix Newsroom · Sep 12, 2025 ·
- Shipment
Micron says its 36GB 12-high HBM3E is qualified on AI platforms
Micron said its 36GB 12-high HBM3E product was qualified on multiple leading AI platforms. The statement did not identify the platforms in the quoted sentence.
- Micron · Jun 12, 2025 ·
Micron HBM3E 36GB 12-high product is now qualified on multiple leading AI platforms.
Editor's note: The page is readable and is dated June 12, 2025. It states verbatim that Micron's HBM3E 36GB 12-high product is qualified on multiple leading AI platforms, without identifying those platforms in that sentence.
- Micron · Jun 12, 2025 ·
- Announcement
Micron ships HBM4 36GB 12-high samples, plans the ramp for calendar 2026
Micron announced shipment of HBM4 36GB 12-high samples to multiple key customers and said it planned to ramp HBM4 in calendar 2026 in line with customers' next-generation AI platforms.
- Micron Investor Relations · Jun 10, 2025 ·
Micron plans to ramp HBM4 in calendar year 2026, aligned to the ramp of customers' next-generation AI platforms.
- Micron Investor Relations · Jun 10, 2025 ·
- Legal
West Lafayette residents challenge rezoning for SK hynix plant
Three West Lafayette residents filed lawsuits in Tippecanoe County Circuit Court. The lawsuits sought to void a rezoning ordinance adopted by the West Lafayette City Council.
- SK hynix · Jul 9, 2026 ·
In June 2025, three residents of West Lafayette, Indiana filed lawsuits in the Tippecanoe County Circuit Court seeking to void a re-zoning ordinance adopted by the West Lafayette City Council.
Editor's note: The prospectus states that, in June 2025, three West Lafayette residents filed lawsuits in Tippecanoe County Circuit Court seeking to void the West Lafayette City Council's rezoning ordinance. This supports both the summary and the stated June 2025 date.
- SK hynix · Jul 9, 2026 ·
- AnnouncementKey moment
JEDEC publishes the HBM4 standard, doubling channels per stack to 32
JEDEC released JESD270-4, the HBM4 standard, which doubles independent channels per stack from 16 to 32 with two pseudo-channels each, keeps backward compatibility with HBM3 controllers and adds directed refresh management. SK hynix, AMD, Synopsys and Cadence gave statements.
- JEDEC · Apr 16, 2025 ·
Doubled Channels: HBM4 doubles the number of independent channels per stack, from 16 channels (HBM3) to 32 channels with 2 pseudo-channels per channel.
- JEDEC · Apr 16, 2025 ·
- Launch
Micron begins volume production of 12-high HBM3E
Micron said it had begun volume production of 12-high HBM3E. The company said it was focused on ramping capacity and yield.
- The Motley Fool (Micron Q2 FY2025 earnings call transcript) · Mar 20, 2025 ·
We have begun volume production of HBM3E 12-high and are focused on ramping capacity and yield.
Editor's note: The page’s prepared remarks state that Micron had begun volume production of HBM3E 12-high and was focused on ramping capacity and yield. The transcript is dated March 20, 2025, matching the node date.
- The Motley Fool (Micron Q2 FY2025 earnings call transcript) · Mar 20, 2025 ·
- AnnouncementKey moment
SK hynix ships the first 12-layer HBM4 samples, targets mass-production readiness in the second half of 2025
SK hynix said it had shipped 12-layer HBM4 samples to major customers, the first supplier to do so, and aimed to complete mass-production preparations within the second half of 2025.
- SK hynix Newsroom · Mar 19, 2025 ·
SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year.
- SK hynix Newsroom · Mar 19, 2025 ·
- Dec 17, 2025Micron completes 2026 HBM price-and-volume agreements
- Sep 24, 2025Counterpoint reports SK hynix and Samsung held 79% of Q2 HBM shipments
- Sep 12, 2025SK hynix completes HBM4 development and says its mass-production system is ready
- Jun 12, 2025Micron says its 36GB 12-high HBM3E is qualified on AI platforms
- Jun 10, 2025Micron ships HBM4 36GB 12-high samples, plans the ramp for calendar 2026
- Jun 2025West Lafayette residents challenge rezoning for SK hynix plant
- Apr 16, 2025JEDEC publishes the HBM4 standard, doubling channels per stack to 32
- Mar 20, 2025Micron begins volume production of 12-high HBM3E
- Mar 19, 2025SK hynix ships the first 12-layer HBM4 samples, targets mass-production readiness in the second half of 2025
20247 entries
- Launch
SK hynix starts mass production of the first 12-layer 36GB HBM3E
SK hynix said it had begun mass production of the world's first 12-layer HBM3E with 36GB, running at 9.6 Gbps, with 3GB dies each 40 percent thinner than before, and planned to supply the product to customers within the year.
- SK hynix Newsroom · Sep 26, 2024 ·
The company plans to supply mass-produced products to customers within the year
Editor's note: Quote confirmed on the SK hynix newsroom release dated September 26, 2024.
- SK hynix Newsroom · Sep 26, 2024 ·
- Regulatory
Commerce offers SK hynix up to US$450 million in CHIPS funding for the Indiana plant
SK hynix signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce for up to US$450 million in proposed direct funding and US$500 million in loans under the CHIPS and Science Act for the Indiana packaging facility.
- SK hynix Newsroom · Aug 6, 2024 ·
SK hynix Inc. announced today it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to $450 million in proposed direct funding and access to proposed loans of $500 million as part of the CHIPS and Science Act
- SK hynix Newsroom · Aug 6, 2024 ·
- Announcement
SK hynix to build the M15X fab in Cheongju for HBM, about 5.3 trillion won, complete by November 2025
SK hynix said it would invest about 5.3 trillion won to build M15X in Cheongju as a new DRAM base focused on HBM, targeting completion in November 2025 for early mass production, next to the M15 plant where TSV capacity was being expanded.
- SK hynix Newsroom · Apr 24, 2024 ·
increasing DRAM capabilities with a focus on HBM is a precondition for future growth.
- SK hynix Newsroom · Apr 24, 2024 ·
- Announcement
SK hynix commits US$3.87 billion to an HBM packaging plant in Indiana
SK hynix signed an agreement with the state of Indiana to build an advanced packaging and R&D facility in West Lafayette for AI memory, with mass production planned for the second half of 2028, the first HBM packaging plant announced in the United States.
- SK hynix Newsroom · Apr 3, 2024 ·
The company plans to begin mass production in the second half of 2028
is contradicted by SK hynix breaks ground on the Indiana HBM packaging plant, now over US$4 billion with production in 2029.
- SK hynix Newsroom · Apr 3, 2024 ·
- LaunchKey moment
SK hynix begins volume production of HBM3E, supplying a customer from late March
SK hynix said it had begun volume production of HBM3E for supply to a customer from late March 2024. It did not name the customer; the announcement came the day after Nvidia's GTC keynote.
- SK hynix Newsroom · Mar 19, 2024 ·
SK hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer from late March.
- SK hynix Newsroom · Mar 19, 2024 ·
- AnnouncementKey moment
Samsung develops the first 12-high 36GB HBM3E, mass production planned for the first half of 2024
Samsung announced HBM3E 12H, a 12-stack, 36GB part it called the highest-capacity HBM to date, said it had begun sampling to customers, and targeted mass production in the first half of 2024.
- Samsung Semiconductor · Feb 27, 2024 ·
Samsung has begun sampling its HBM3E 12H to customers and mass production is slated for the first half of this year.
- Samsung Semiconductor · Feb 27, 2024 ·
- Launch
Micron starts volume production of HBM3E for Nvidia's H200
Micron said it had begun volume production of its 24GB 8-high HBM3E, which would ship inside Nvidia H200 GPUs from the second calendar quarter of 2024, making Micron a first-wave HBM3E supplier alongside SK hynix.
- Micron Investor Relations · Feb 26, 2024 ·
Micron's 24GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024.
result of Nvidia announces the H200, the first GPU with HBM3e memory on Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin.
- Micron Investor Relations · Feb 26, 2024 ·
- Sep 26, 2024SK hynix starts mass production of the first 12-layer 36GB HBM3E
- Aug 6, 2024Commerce offers SK hynix up to US$450 million in CHIPS funding for the Indiana plant
- Apr 24, 2024SK hynix to build the M15X fab in Cheongju for HBM, about 5.3 trillion won, complete by November 2025
- Apr 3, 2024SK hynix commits US$3.87 billion to an HBM packaging plant in Indiana
- Mar 19, 2024SK hynix begins volume production of HBM3E, supplying a customer from late March
- Feb 27, 2024Samsung develops the first 12-high 36GB HBM3E, mass production planned for the first half of 2024
- Feb 26, 2024Micron starts volume production of HBM3E for Nvidia's H200
Questions this timeline answers
Each one is an ordered set of dated entries, most of them from this page, with a line on why each step led to the next.
Cause and effect
- SK hynix completes HBM4 development and says its mass-production system is readyis contradicted by →TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the specSK hynix declared mass production ready in September 2025; TrendForce reported the start slipping to late in the first quarter of 2026 after Nvidia raised the per-pin speed.
- SK hynix commits US$3.87 billion to an HBM packaging plant in Indianais contradicted by →SK hynix breaks ground on the Indiana HBM packaging plant, now over US$4 billion with production in 2029The April 2024 plan said mass production in the second half of 2028; at the 2026 groundbreaking it became the second half of 2029.
- Micron in volume shipment of HBM4 for Nvidia Vera Rubinis contradicted by →Electronic Times reports Micron began 12-layer HBM4 mass production in Q2The existing entry dates Micron's HBM4 volume shipment for Nvidia Vera Rubin to 2026-03-16, while Electronic Times reported that Micron began 12-layer HBM4 mass production in the second quarter of 2026.
- Reuters reports SK hynix and Intel held U.S. memory manufacturing talkswas answered by →SK hynix says no U.S. memory-production plan or arrangement is finalizedSK hynix’s September 16 statement addressed the reported Intel discussions by saying that no specific plans or arrangements had been finalized.
- Nvidia announces the H200, the first GPU with HBM3e memory on Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubinled to →Micron starts volume production of HBM3E for Nvidia's H200Nvidia announced that H200 would use HBM3e and ship in the second quarter of 2024, and Micron subsequently began HBM3E production for shipment inside H200 GPUs in that quarter.
- Nvidia discloses a Blackwell mask change to improve yields on its Q2 FY2025 call on Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubinled to →TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the specAfter Nvidia said Blackwell demand was well above supply, TrendForce said strong Blackwell demand led Nvidia to adjust the Rubin production timeline, contributing to the HBM4 production delay.
- TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the specis contradicted by →NVIDIA says its roadmap is intact on Nvidia Data Center GPUs: Hopper, Blackwell and Vera RubinTrendForce said Nvidia had adjusted the Rubin production timeline because of strong Blackwell demand, whereas NVIDIA later said its roadmap was intact.
- Reuters reports SK hynix and Intel held U.S. memory manufacturing talkswas answered by →SK hynix says no decision has been made on reported Intel scenarios on Intel Foundry and 18A: From IDM 2.0 to a Government-Owned StakeAfter Reuters reported exploratory discussions for SK hynix to manufacture memory chips using Intel's Ohio site, SK hynix said no decisions had been made on the reported scenarios.
- Reuters reports possible SK hynix use of Intel's Ohio facility on Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stakewas answered by →SK hynix says no U.S. memory-production plan or arrangement is finalizedAfter Reuters reported exploratory Intel–SK hynix discussions about U.S. memory-chip manufacturing, SK hynix said no specific U.S. memory-production plan or arrangement had been finalized.
Where sources disagree or fall silent
- SK hynix said in September 2025 that its HBM4 mass-production system was ready, while TrendForce later said Nvidia’s revised Rubin specification pushed industry HBM4 production to no earlier than the end of the first quarter of 2026; the distinction between readiness and customer-qualified production is not fully detailed.
- Micron said it began HBM4 volume shipments for Nvidia Vera Rubin in the first quarter of 2026, whereas Electronic Times reported that its 12-layer HBM4 mass production began in the second quarter.
- Samsung and SK hynix have shipped HBM4E samples, but the customers, qualification results, volume-production dates and allocations for those products have not been disclosed.
- Micron has agreements for most of its 2027 HBM supply, but the public record does not give comparable confirmed 2027 allocation and pricing details for Samsung or SK hynix.
- SK hynix’s Indiana plant is now expected to begin production in the second half of 2029 rather than 2028, and the final outcome of local rezoning litigation and any U.S. manufacturing arrangement with Intel remains unclear.
What to watch next
- Oct 2028 — SK hynix Indiana packaging-plant cleanroom due Cleanroom completion is the next dated construction milestone before SK hynix targets next-generation HBM mass production at the West Lafayette site in the second half of 2029.
Who is involved
- SK hynixcompany
Moved from early HBM3E production to HBM4 mass shipments in 2026, sampled HBM4E, and is expanding packaging capacity in Korea and Indiana.
- HBM4product
The current generation, standardized in 2025 and shipped by Samsung, Micron and SK hynix for next-generation AI systems in 2026.
- Microncompany
Third supplier; entered with HBM3E in H200 and volume HBM4 for Vera Rubin.
- Samsungcompany
HBM supplier that missed the first Nvidia HBM3E wave but announced commercial HBM4 shipments in February 2026 and HBM4E samples in May.
- Nvidiacompany
The main AI-accelerator customer shaping HBM requirements; its Rubin HBM4 speed specification change affected supplier schedules.
- HBMproduct
High-bandwidth-memory category covered by shipment-share and supply-agreement statements.
- HBM3Eproduct
The prior HBM generation that entered broad supplier production in 2024 and was qualified on leading AI platforms in 2025.
- HBM4Eproduct
The next HBM variant: Samsung and SK hynix have shipped samples, while Micron expects volume production in 2027.
17 more
- TrendForceother
Market research firm reporting on the Nvidia-driven HBM4 schedule revision, supplier shipment growth, and projected HBM price increases.
- Vera Rubinproduct
Nvidia accelerator identified as the installation target for Micron's 12-layer HBM4 product.
- State of Indianaregulator
Signed an agreement with SK hynix to build an advanced packaging and R&D facility in West Lafayette.
- 1-gamma DRAMproduct
DRAM technology Micron said would underpin HBM4E.
- AMDcompany
An AI-platform customer connected to Micron’s qualified HBM3E product and a participant in the HBM4 standard announcement.
- conventional DRAMproduct
Memory category Micron used as the comparator for projected HBM bit-shipment growth.
- Counterpoint Researchcompany
Market research firm that reported SK hynix and Samsung together held about 79% of HBM shipments in the second quarter of 2025.
- DDR5product
Memory-module product whose capacity growth was reportedly directed to external firms.
- Intelcompany
Held exploratory discussions with SK hynix about possible U.S. memory manufacturing, though SK hynix said no arrangement was finalized.
- JEDECother
The memory standards body that released the JESD270-4 HBM4 specification in April 2025.
- NV-HBMproduct
Micron’s described custom HBM4E implementation being developed with Nvidia for future GPUs and NVLink Fusion platforms.
- NVLink Fusionproduct
NVIDIA platform named as a future adoption platform for Micron's NV-HBM.
- Reuterscompany
Cited by TrendForce as the source for the reported HBM bit-shipment increase.
- SSDproduct
Storage product whose capacity growth was reportedly directed to external firms.
- Tippecanoe County Circuit Courtregulator
Court where the rezoning lawsuits were filed and which ruled on standing.
- U.S. Department of Commerceregulator
Offered proposed CHIPS Act funding and loans for SK hynix’s Indiana advanced-packaging facility.
- West Lafayette City Councilregulator
Adopted the rezoning ordinance challenged in the lawsuits.
Changelog
- Linked 1 entry with Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin. Added 1 entry: 2026-10-08 Samsung's quarterly operating profit passes 100 trillion won for the first time, on HBM4.
- Added 12 entries: 2025-06 West Lafayette residents challenge rezoning for SK hynix plant; 2026-09-19 Samsung directs DDR5 and SSD capacity growth to external firms; 2026-09-20 Report says Samsung HBM4 yield rose to about 80%; 2026-09-20 Report expects Samsung to more than double HBM4-family output in 2027 and 8 more. Linked 2 entries with Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake. Linked 1 entry with Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin.
- Added 2 entries: 2026-09-16 Reuters reports SK hynix and Intel held U.S. memory manufacturing talks; 2026-09-16 SK hynix says no U.S. memory-production plan or arrangement is finalized. Linked 1 entry with Nvidia Data Center GPUs: Hopper, Blackwell and Vera Rubin.
- Added 2 entries: 2026-09-04 Electronic Times reports Micron began 12-layer HBM4 mass production in Q2; 2026-09-07 TrendForce links Samsung's Q2 shipment growth to HBM4 ramp.
- Added 2 entries: 2025-03-20 Micron begins volume production of 12-high HBM3E; 2025-12-17 Micron completes 2026 HBM price-and-volume agreements.
- Added 7 entries: 2024-09-26 SK hynix starts mass production of the first 12-layer 36GB HBM3E; 2025-06-12 Micron says its 36GB 12-high HBM3E is qualified on AI platforms; 2025-09-24 Counterpoint reports SK hynix and Samsung held 79% of Q2 HBM shipments; 2026-06-18 SK hynix ships 12-layer HBM4E samples to major customers and 3 more. Added 15 hand-verified entries by the editor.
A research pass records each dated fact with the page it came from and a verbatim quote. A second, independent pass re-opens every cited page and rejects entries it cannot confirm. The editor reviews what remains before it is published, and every change is listed above. Full method.