Micron

Micron forecast industry HBM bit shipments would grow faster than conventional DRAM through calendar 2028. Reuters reported that Micron expected memory and storage supply and demand conditions to be tighter in fiscal 2027 and 2028 than in 2026.

Micron said clean-room preparation at its Singapore HBM advanced-packaging facility was ahead of plan. It expected initial output in early calendar 2027.

Micron said it was working with NVIDIA on NV-HBM. Micron described NV-HBM as a custom HBM4E implementation for next-generation GPUs and NVLink Fusion platforms.

Micron said it had completed agreements for the vast majority of its calendar-2027 HBM bit supply, with significant year-over-year price increases that narrow the gross-margin gap with conventional DRAM.

VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.

TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.

Electronic Times reported that Micron began mass production of 12-layer HBM4 products in the second quarter of 2026. The report identified the products as 12-layer HBM4. The same report said Micron plans to add up to 60,000 wafers a month of HBM capacity by the end of 2026.

Micron Technology announced a $250 million Trump Accounts commitment combining employee matches and local seed deposits. It said it would match employee contributions up to $1,000 per child and provide one-time $250 deposits in communities where it operates.

Micron said development of HBM4E using 1-gamma DRAM technology was underway. The company said it expected volume production in calendar 2027.

Micron said it had begun volume shipment of HBM4 36GB 12-high in the first quarter of calendar 2026, designed for Nvidia's Vera Rubin platform, with a 2048-bit interface above 11 Gbps and more than 2.8 TB/s per stack.

TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of 2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin speed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand led Nvidia to adjust the Rubin production timeline.

Micron said it had completed price-and-volume agreements for its entire calendar-2026 HBM supply. The agreements included its HBM4 supply.

Micron said its 36GB 12-high HBM3E product was qualified on multiple leading AI platforms. The statement did not identify the platforms in the quoted sentence.

Micron announced shipment of HBM4 36GB 12-high samples to multiple key customers and said it planned to ramp HBM4 in calendar 2026 in line with customers' next-generation AI platforms.

Micron said it had begun volume production of 12-high HBM3E. The company said it was focused on ramping capacity and yield.

Micron said it had begun volume production of its 24GB 8-high HBM3E, which would ship inside Nvidia H200 GPUs from the second calendar quarter of 2024, making Micron a first-wave HBM3E supplier alongside SK hynix.