{
  "data_version": "1",
  "schema": "https://whatledto.com/data",
  "id": "micron",
  "name": "Micron",
  "kind": "company",
  "url": "https://whatledto.com/who/micron",
  "description": "U.S. memory maker ramping HBM production.",
  "same_as": [
    "https://en.wikipedia.org/wiki/Micron_Technology",
    "https://www.micron.com/"
  ],
  "timelines": [
    {
      "slug": "trump-accounts-rollout",
      "title": "Trump Accounts: From the 2025 Tax Law to the July 2026 Launch and the Employer Matches",
      "url": "https://whatledto.com/events/trump-accounts-rollout",
      "json": "https://whatledto.com/events/trump-accounts-rollout.json",
      "role": "Committed $250 million through employee matches and local seed deposits.",
      "entries": 1,
      "updated_at": "2026-10-14T15:05:02.561257+00:00"
    },
    {
      "slug": "nvidia-consumer-gpu-dlss",
      "title": "GeForce and DLSS: From the RTX 50 Launch to 3D-Guided Neural Rendering",
      "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss",
      "json": "https://whatledto.com/events/nvidia-consumer-gpu-dlss.json",
      "role": "Memory supplier reported to be moving away from 2GB GDDR7 chips used on some RTX 50 cards in favor of higher-density products.",
      "entries": 1,
      "updated_at": "2026-10-14T06:38:45.665711+00:00"
    },
    {
      "slug": "hbm-memory-supply",
      "title": "HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E",
      "url": "https://whatledto.com/events/hbm-memory-supply",
      "json": "https://whatledto.com/events/hbm-memory-supply.json",
      "role": "Third supplier; entered with HBM3E in H200 and volume HBM4 for Vera Rubin.",
      "entries": 14,
      "updated_at": "2026-10-14T05:44:42.508947+00:00"
    }
  ],
  "entries": [
    {
      "timeline": "hbm-memory-supply",
      "id": 1763,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1763",
      "date": "2026-09-30",
      "date_precision": "day",
      "title": "Micron forecasts HBM bit shipments will outgrow conventional DRAM",
      "summary": "Micron forecast industry HBM bit shipments would grow faster than conventional DRAM through calendar 2028. Reuters reported that Micron expected memory and storage supply and demand conditions to be tighter in fiscal 2027 and 2028 than in 2026.",
      "type": "financial",
      "entities": [
        "Micron",
        "HBM",
        "conventional DRAM"
      ],
      "parties": [
        "micron",
        "hbm",
        "conventional-dram"
      ],
      "sources": [
        {
          "url": "https://stockanalysis.com/stocks/mu/transcripts/699706-q4-2026/",
          "outlet": "Stock Analysis",
          "published": "2026-09-30",
          "quote": "“We expect industry HBM bit shipments to grow faster than conventional DRAM through calendar 2028.”"
        },
        {
          "url": "https://www.streetinsider.com/Reuters/Microns%2BAI-fueled%2Brevenue%2Bforecast%2Bblows%2Bpast%2Bestimates%2C%2Bbacklog%2Bswells/27128705.html",
          "outlet": "Reuters",
          "published": "2026-09-30",
          "quote": "“The company expects memory and storage supply and demand conditions to be much tighter in fiscal 2027 and 2028 compared with 2026, the CEO said.”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1762,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1762",
      "date": "2026-09-30",
      "date_precision": "day",
      "title": "Micron says Singapore HBM packaging preparation is ahead of plan",
      "summary": "Micron said clean-room preparation at its Singapore HBM advanced-packaging facility was ahead of plan. It expected initial output in early calendar 2027.",
      "type": "other",
      "entities": [
        "Micron",
        "HBM"
      ],
      "parties": [
        "micron",
        "hbm"
      ],
      "sources": [
        {
          "url": "https://stockanalysis.com/stocks/mu/transcripts/699706-q4-2026/",
          "outlet": "Stock Analysis",
          "published": "2026-09-30",
          "quote": "“In Singapore, clean room preparation is ahead of plan at our HBM advanced packaging facility, with initial output expected in early calendar 2027.”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1761,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1761",
      "date": "2026-09-30",
      "date_precision": "day",
      "title": "Micron says it is working with NVIDIA on NV-HBM",
      "summary": "Micron said it was working with NVIDIA on NV-HBM. Micron described NV-HBM as a custom HBM4E implementation for next-generation GPUs and NVLink Fusion platforms.",
      "type": "announcement",
      "entities": [
        "Micron",
        "Nvidia",
        "NV-HBM",
        "HBM4E",
        "NVLink Fusion"
      ],
      "parties": [
        "micron",
        "nvidia",
        "nv-hbm",
        "hbm4e",
        "nvlink-fusion"
      ],
      "sources": [
        {
          "url": "https://stockanalysis.com/stocks/mu/transcripts/699706-q4-2026/",
          "outlet": "Stock Analysis",
          "published": "2026-09-30",
          "quote": "“We have a strong roadmap for future HBM products and are proud to be working with NVIDIA on the industry's first custom HBM4E implementation, NV-HBM, to be adopted on next generation of GPUs and NVLink Fusion platforms.”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1760,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1760",
      "date": "2026-09-30",
      "date_precision": "day",
      "title": "Micron contracts most of its 2027 HBM bit supply",
      "summary": "Micron said it had completed agreements for the vast majority of its calendar-2027 HBM bit supply, with significant year-over-year price increases that narrow the gross-margin gap with conventional DRAM.",
      "type": "financial",
      "entities": [
        "Micron",
        "HBM"
      ],
      "parties": [
        "micron",
        "hbm"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/files/doc_financials/2026/q4/Q4-FY26-Prepared-Remarks.pdf",
          "outlet": "Micron Technology, Inc.",
          "published": "2026-09-30",
          "quote": "We have completed agreements for the vast majority of our calendar 2027 HBM bit supply with significant price increases year over year, narrowing the gross margin gap with conventional DRAM."
        },
        {
          "url": "https://stockanalysis.com/stocks/mu/transcripts/699706-q4-2026/",
          "outlet": "Stock Analysis",
          "published": "2026-09-30",
          "quote": "“We have completed agreements for the vast majority of our calendar 2027 HBM bit supply with significant price increases year-over-year, narrowing the gross margin gap with conventional DRAM.”"
        },
        {
          "url": "https://www.streetinsider.com/Reuters/Microns%2BAI-fueled%2Brevenue%2Bforecast%2Bblows%2Bpast%2Bestimates%2C%2Bbacklog%2Bswells/27128705.html",
          "outlet": "Reuters",
          "published": "2026-09-30",
          "quote": "“Mehrotra also said that Micron has secured agreements for most of its 2027 high-bandwidth memory output and will increase fiscal 2027 capital spending above prior plans to add capacity.”"
        }
      ]
    },
    {
      "timeline": "nvidia-consumer-gpu-dlss",
      "id": 1514,
      "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss#n1514",
      "date": "2026-09-22",
      "date_precision": "day",
      "title": "Reports say Micron moved away from 2GB GDDR7 for RTX 50 cards",
      "summary": "VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.",
      "type": "report",
      "entities": [
        "Micron",
        "GDDR7",
        "GeForce RTX 50 Series",
        "GeForce RTX 5060",
        "Samsung",
        "SK hynix",
        "GALAX",
        "VideoCardz",
        "Tom’s Hardware"
      ],
      "parties": [
        "micron",
        "gddr7",
        "geforce-rtx-50-series",
        "geforce-rtx-5060",
        "samsung",
        "sk-hynix",
        "galax",
        "videocardz",
        "toms-hardware"
      ],
      "sources": [
        {
          "url": "https://videocardz.com/newz/micron-reportedly-ends-production-of-2gb-gddr7-used-by-geforce-rtx-50",
          "outlet": "VideoCardz",
          "published": "2026-09-22",
          "quote": "“Micron appears to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.”"
        },
        {
          "url": "https://www.tomshardware.com/pc-components/ram/micron-discontinues-2gb-gddr7-chips-for-gaming-gpus-as-it-pivots-toward-higher-density-memory-for-ai-chipmaker-reportedly-pivots-to-high-margin-3gb-silicon-for-ai-gpus",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-24",
          "quote": "“Tom’s Hardware can confirm that the pages for module norms return ‘No results found.’”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 770,
      "url": "https://whatledto.com/events/hbm-memory-supply#n770",
      "date": "2026-09-07",
      "date_precision": "day",
      "title": "TrendForce links Samsung's Q2 shipment growth to HBM4 ramp",
      "summary": "TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.",
      "type": "report",
      "entities": [
        "Samsung",
        "SK hynix",
        "Micron",
        "TrendForce"
      ],
      "parties": [
        "samsung",
        "sk-hynix",
        "micron",
        "trendforce"
      ],
      "sources": [
        {
          "url": "https://www.trendforce.com/presscenter/news/20260907-13219.html",
          "outlet": "TrendForce",
          "published": "2026-09-07",
          "quote": "TrendForce notes that Samsung posted the strongest QoQ bit shipment growth among the three major suppliers in 2Q26, supported by its early move into HBM4 mass production and shipments."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 769,
      "url": "https://whatledto.com/events/hbm-memory-supply#n769",
      "date": "2026-09-04",
      "date_precision": "day",
      "title": "Electronic Times reports Micron began 12-layer HBM4 mass production in Q2",
      "summary": "Electronic Times reported that Micron began mass production of 12-layer HBM4 products in the second quarter of 2026. The report identified the products as 12-layer HBM4. The same report said Micron plans to add up to 60,000 wafers a month of HBM capacity by the end of 2026.",
      "type": "report",
      "entities": [
        "Micron",
        "Nvidia",
        "Vera Rubin"
      ],
      "parties": [
        "micron",
        "nvidia",
        "vera-rubin"
      ],
      "sources": [
        {
          "url": "https://en.etnews.com/20260904200006",
          "outlet": "Electronic Times",
          "published": "2026-09-04",
          "quote": "Micron began mass production of 12-layer HBM4 products in the second quarter of this year."
        }
      ]
    },
    {
      "timeline": "trump-accounts-rollout",
      "id": 751,
      "url": "https://whatledto.com/events/trump-accounts-rollout#n751",
      "date": "2026-06-30",
      "date_precision": "day",
      "title": "Micron announces $250 million commitment for Trump Accounts",
      "summary": "Micron Technology announced a $250 million Trump Accounts commitment combining employee matches and local seed deposits. It said it would match employee contributions up to $1,000 per child and provide one-time $250 deposits in communities where it operates.",
      "type": "announcement",
      "entities": [
        "Micron"
      ],
      "parties": [
        "micron"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news/press-release/2026/Micron-Announces-250-Million-Investment-in-Trump-Accounts-Reaching-1-Million-Children-Families-and-the-Future-Workforce/default.aspx",
          "outlet": "Micron Technology",
          "published": "2026-06-30",
          "quote": "Micron’s investment is the largest corporate commitment of its kind and is expected to support up to one million children."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 156,
      "url": "https://whatledto.com/events/hbm-memory-supply#n156",
      "date": "2026-06-24",
      "date_precision": "day",
      "title": "Micron expects HBM4E volume production in 2027",
      "summary": "Micron said development of HBM4E using 1-gamma DRAM technology was underway. The company said it expected volume production in calendar 2027.",
      "type": "financial",
      "entities": [
        "Micron",
        "HBM4E",
        "1-gamma DRAM"
      ],
      "parties": [
        "micron",
        "hbm4e",
        "1-gamma-dram"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news/press-release/2026/Micron-Technology-Inc--Reports-Record-Results-for-the-Third-Quarter-of-Fiscal-2026/default.aspx",
          "outlet": "Micron",
          "published": "2026-06-24",
          "quote": "Development of HBM4E, built on 1-gamma DRAM technology, is well underway, with volume production expected in calendar 2027."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 147,
      "url": "https://whatledto.com/events/hbm-memory-supply#n147",
      "date": "2026-03-16",
      "date_precision": "day",
      "title": "Micron in volume shipment of HBM4 for Nvidia Vera Rubin",
      "summary": "Micron said it had begun volume shipment of HBM4 36GB 12-high in the first quarter of calendar 2026,\ndesigned for Nvidia's Vera Rubin platform, with a 2048-bit interface above 11 Gbps and more than 2.8 TB/s per\nstack.",
      "type": "launch",
      "entities": [
        "Micron",
        "Nvidia",
        "HBM4"
      ],
      "parties": [
        "micron",
        "nvidia",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news-releases/news-release-details/micron-high-volume-production-hbm4-designed-nvidia-vera-rubin",
          "outlet": "Micron Investor Relations",
          "published": "2026-03-16",
          "quote": "Micron Technology, Inc. (Nasdaq: MU), has begun volume shipment of its HBM4 36GB 12H in the first quarter of calendar year 2026"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 145,
      "url": "https://whatledto.com/events/hbm-memory-supply#n145",
      "date": "2026-01-08",
      "date_precision": "day",
      "title": "TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec",
      "summary": "TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of\n2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin\nspeed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand\nled Nvidia to adjust the Rubin production timeline.",
      "type": "report",
      "entities": [
        "TrendForce",
        "Nvidia",
        "SK hynix",
        "Samsung",
        "Micron",
        "HBM4"
      ],
      "parties": [
        "trendforce",
        "nvidia",
        "sk-hynix",
        "samsung",
        "micron",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://www.trendforce.com/presscenter/news/20260108-12869.html",
          "outlet": "TrendForce",
          "published": "2026-01-08",
          "quote": "Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This change has necessitated that the three major HBM suppliers modify their designs."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 154,
      "url": "https://whatledto.com/events/hbm-memory-supply#n154",
      "date": "2025-12-17",
      "date_precision": "day",
      "title": "Micron completes 2026 HBM price-and-volume agreements",
      "summary": "Micron said it had completed price-and-volume agreements for its entire calendar-2026 HBM supply. The agreements included its HBM4 supply.",
      "type": "financial",
      "entities": [
        "Micron",
        "HBM",
        "HBM4"
      ],
      "parties": [
        "micron",
        "hbm",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://www.fool.com/earnings/call-transcripts/2025/12/17/micron-mu-q1-2026-earnings-call-transcript/",
          "outlet": "The Motley Fool (Micron Q1 FY2026 earnings call transcript)",
          "published": "2025-12-17",
          "quote": "We have completed agreements on price and volume for our entire calendar 2026 HBM supply, including Micron's industry-leading HBM4."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 151,
      "url": "https://whatledto.com/events/hbm-memory-supply#n151",
      "date": "2025-06-12",
      "date_precision": "day",
      "title": "Micron says its 36GB 12-high HBM3E is qualified on AI platforms",
      "summary": "Micron said its 36GB 12-high HBM3E product was qualified on multiple leading AI platforms. The statement did not identify the platforms in the quoted sentence.",
      "type": "shipment",
      "entities": [
        "Micron",
        "HBM3E"
      ],
      "parties": [
        "micron",
        "hbm3e"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news/press-release/2025/Micron-HBM-Designed-into-Leading-AMD-AI-Platform-06-12-2025/default.aspx",
          "outlet": "Micron",
          "published": "2025-06-12",
          "quote": "Micron HBM3E 36GB 12-high product is now qualified on multiple leading AI platforms."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 143,
      "url": "https://whatledto.com/events/hbm-memory-supply#n143",
      "date": "2025-06-10",
      "date_precision": "day",
      "title": "Micron ships HBM4 36GB 12-high samples, plans the ramp for calendar 2026",
      "summary": "Micron announced shipment of HBM4 36GB 12-high samples to multiple key customers and said it planned to\nramp HBM4 in calendar 2026 in line with customers' next-generation AI platforms.",
      "type": "announcement",
      "entities": [
        "Micron",
        "HBM4"
      ],
      "parties": [
        "micron",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news-releases/news-release-details/micron-ships-hbm4-key-customers-power-next-gen-ai-platforms",
          "outlet": "Micron Investor Relations",
          "published": "2025-06-10",
          "quote": "Micron plans to ramp HBM4 in calendar year 2026, aligned to the ramp of customers' next-generation AI platforms."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 150,
      "url": "https://whatledto.com/events/hbm-memory-supply#n150",
      "date": "2025-03-20",
      "date_precision": "day",
      "title": "Micron begins volume production of 12-high HBM3E",
      "summary": "Micron said it had begun volume production of 12-high HBM3E. The company said it was focused on ramping capacity and yield.",
      "type": "launch",
      "entities": [
        "Micron",
        "HBM3E"
      ],
      "parties": [
        "micron",
        "hbm3e"
      ],
      "sources": [
        {
          "url": "https://www.fool.com/earnings/call-transcripts/2025/03/20/micron-technology-mu-q2-2025-earnings-call-transcr/",
          "outlet": "The Motley Fool (Micron Q2 FY2025 earnings call transcript)",
          "published": "2025-03-20",
          "quote": "We have begun volume production of HBM3E 12-high and are focused on ramping capacity and yield."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 135,
      "url": "https://whatledto.com/events/hbm-memory-supply#n135",
      "date": "2024-02-26",
      "date_precision": "day",
      "title": "Micron starts volume production of HBM3E for Nvidia's H200",
      "summary": "Micron said it had begun volume production of its 24GB 8-high HBM3E, which would ship inside Nvidia H200\nGPUs from the second calendar quarter of 2024, making Micron a first-wave HBM3E supplier alongside SK hynix.",
      "type": "launch",
      "entities": [
        "Micron",
        "Nvidia",
        "HBM3E"
      ],
      "parties": [
        "micron",
        "nvidia",
        "hbm3e"
      ],
      "sources": [
        {
          "url": "https://investors.micron.com/news/press-release/2024/Micron-Commences-Volume-Production-of-Industry-Leading-HBM3E-Solution-to-Accelerate-the-Growth-of-AI-02-26-2024/default.aspx",
          "outlet": "Micron Investor Relations",
          "published": "2024-02-26",
          "quote": "Micron's 24GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024."
        }
      ]
    }
  ],
  "often_with": [
    {
      "id": "nvidia",
      "name": "Nvidia",
      "url": "https://whatledto.com/who/nvidia",
      "json": "https://whatledto.com/who/nvidia.json",
      "shared_timelines": 2
    },
    {
      "id": "sk-hynix",
      "name": "SK hynix",
      "url": "https://whatledto.com/who/sk-hynix",
      "json": "https://whatledto.com/who/sk-hynix.json",
      "shared_timelines": 2
    },
    {
      "id": "samsung",
      "name": "Samsung",
      "url": "https://whatledto.com/who/samsung",
      "json": "https://whatledto.com/who/samsung.json",
      "shared_timelines": 2
    },
    {
      "id": "us-government",
      "name": "U.S. government",
      "url": "https://whatledto.com/who/us-government",
      "json": "https://whatledto.com/who/us-government.json",
      "shared_timelines": 1
    },
    {
      "id": "donald-trump",
      "name": "Donald Trump",
      "url": "https://whatledto.com/who/donald-trump",
      "json": "https://whatledto.com/who/donald-trump.json",
      "shared_timelines": 1
    },
    {
      "id": "goldman-sachs",
      "name": "Goldman Sachs",
      "url": "https://whatledto.com/who/goldman-sachs",
      "json": "https://whatledto.com/who/goldman-sachs.json",
      "shared_timelines": 1
    },
    {
      "id": "american-airlines",
      "name": "American Airlines",
      "url": "https://whatledto.com/who/american-airlines",
      "json": "https://whatledto.com/who/american-airlines.json",
      "shared_timelines": 1
    },
    {
      "id": "us-securities-and-exchange-commission",
      "name": "U.S. Securities and Exchange Commission",
      "url": "https://whatledto.com/who/us-securities-and-exchange-commission",
      "json": "https://whatledto.com/who/us-securities-and-exchange-commission.json",
      "shared_timelines": 1
    }
  ],
  "license": {
    "holder": "What Led To",
    "terms": "https://whatledto.com/methodology#reuse",
    "summary": "Quote entries with attribution and a link to the entry; do not republish whole timelines or train models on the text."
  }
}