Samsung

Samsung Electronics' preliminary third-quarter 2026 guidance put consolidated operating profit at about 107.4 trillion won, up 782.5 percent year on year, and revenue at about 195 trillion won, up 126.6 percent. TrendForce reported it as a record quarter in which operating profit crossed 100 trillion won for the first time and beat the LSEG SmartEstimate of 106.1 trillion won. It said HBM4 sales began making a meaningful contribution during the quarter, driven by demand for Nvidia's Vera Rubin accelerator, and cited Reuters for Samsung's HBM bit shipments jumping nearly 50 percent quarter on quarter.

Windows Central reported that Xbox Cloud Gaming was retiring its app on some TV sets and said the cause was the sets themselves: the latest version of the service needs newer Chromium APIs, Samsung has no plans to update its Tizen-based 2020 TVs, and Chromium there has not been updated in almost a decade. Its sources said there were no plans to slow Xbox Cloud Gaming down, and that reports Microsoft had cancelled forthcoming cloud-gaming controllers were false.

VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.

MoneyToday reported that Samsung Electronics was reviewing an expansion of its 4nm foundry-process capacity. The report said the review was to meet growing demand for HBM4 base dies.

Seoul Economic Daily reported that Samsung Electronics was expected to more than double output of its HBM4-family chips in 2027. The report included HBM4 and HBM4E in that expectation.

Seoul Economic Daily reported that Samsung's HBM4 yield was below 60% in the early stages of mass production. The report said the yield had recently climbed to around 80%.

TechRadar reported that Samsung was directing capacity growth for DDR5 modules and SSDs to external firms. The report said Samsung was reserving in-house capacity for HBM packaging.

OpenAI said it had not announced plans to manufacture chips through Samsung Electronics. It said it had nothing new to announce regarding reports about next-generation chips.

TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.

Samsung said it had begun shipping 12-layer HBM4E samples to major customers, reaching up to 16 Gbps with better energy efficiency and thermals, extending its roadmap after the HBM4 mass production earlier in the year.

At Nvidia's GTC 2026 Samsung made its sixth-generation HBM4, in mass production and designed for the Vera Rubin platform, the centerpiece of its showcase and unveiled HBM4E, positioning itself as a Nvidia supplier after missing the first HBM3E wave.

Samsung announced mass production and commercial shipment of HBM4 running at 11.7 Gbps and capable of up to 13 Gbps, on a 4nm logic base die, and said it expected its HBM sales to more than triple in 2026 while expanding HBM4 capacity. It was Samsung's first claim of an HBM generation lead over SK hynix.

TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of 2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin speed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand led Nvidia to adjust the Rubin production timeline.

Counterpoint Research reported that SK hynix held 62% and Samsung Electronics held 17% of global HBM shipment share in the second quarter of 2025. The reported combined share was about 79%.

Samsung announced HBM3E 12H, a 12-stack, 36GB part it called the highest-capacity HBM to date, said it had begun sampling to customers, and targeted mass production in the first half of 2024.