SK hynix

SK hynix displayed NVIDIA's Vera Rubin superchip. The superchip was equipped with SK hynix's 12-layer 36GB HBM4 and 96GB SOCAMM2.

VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.

SK hynix said no decisions had been made regarding the two scenarios reported in the article. The statement addressed reported possible arrangements involving Intel and U.S. memory-chip production.

Reuters reported exploratory discussions between SK hynix and Intel about possible U.S. memory-chip manufacturing using Intel's Ohio site. One potential scenario described by Reuters' sources was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.

SK hynix said it was exploring options to strengthen its global competitiveness. It said no specific plans or arrangements had been finalized.

Reuters reported that SK hynix was holding exploratory discussions with Intel about manufacturing memory chips in the United States. One potential scenario was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.

TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.

SK hynix held the groundbreaking ceremony for its West Lafayette, Indiana advanced packaging plant at Purdue University. The expected investment rose to over US$4 billion, the cleanroom is due by October 2028 and mass production of next-generation HBM in the second half of 2029, a year later than the 2028 target given in April 2024.

SK hynix said it began mass shipments of HBM4 in the second quarter of 2026. It said it would ramp production in the second half of the year.

SK hynix announced that it had shipped HBM4E samples to major customers. The samples were for a 12-layer HBM4E product.

TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of 2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin speed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand led Nvidia to adjust the Rubin production timeline.

Counterpoint Research reported that SK hynix held 62% and Samsung Electronics held 17% of global HBM shipment share in the second quarter of 2025. The reported combined share was about 79%.

SK hynix announced it had completed HBM4 development and finished preparing mass production, the first supplier to claim both, on the schedule it set in March.

Three West Lafayette residents filed lawsuits in Tippecanoe County Circuit Court. The lawsuits sought to void a rezoning ordinance adopted by the West Lafayette City Council.

JEDEC released JESD270-4, the HBM4 standard, which doubles independent channels per stack from 16 to 32 with two pseudo-channels each, keeps backward compatibility with HBM3 controllers and adds directed refresh management. SK hynix, AMD, Synopsys and Cadence gave statements.

SK hynix said it had shipped 12-layer HBM4 samples to major customers, the first supplier to do so, and aimed to complete mass-production preparations within the second half of 2025.

SK hynix said it had begun mass production of the world's first 12-layer HBM3E with 36GB, running at 9.6 Gbps, with 3GB dies each 40 percent thinner than before, and planned to supply the product to customers within the year.

SK hynix signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce for up to US$450 million in proposed direct funding and US$500 million in loans under the CHIPS and Science Act for the Indiana packaging facility.

SK hynix said it would invest about 5.3 trillion won to build M15X in Cheongju as a new DRAM base focused on HBM, targeting completion in November 2025 for early mass production, next to the M15 plant where TSV capacity was being expanded.

SK hynix signed an agreement with the state of Indiana to build an advanced packaging and R&D facility in West Lafayette for AI memory, with mass production planned for the second half of 2028, the first HBM packaging plant announced in the United States.

SK hynix said it had begun volume production of HBM3E for supply to a customer from late March 2024. It did not name the customer; the announcement came the day after Nvidia's GTC keynote.