{
  "data_version": "1",
  "schema": "https://whatledto.com/data",
  "id": "sk-hynix",
  "name": "SK hynix",
  "kind": "company",
  "url": "https://whatledto.com/who/sk-hynix",
  "description": "Leading supplier of HBM memory to Nvidia.",
  "same_as": [
    "https://en.wikipedia.org/wiki/SK_Hynix",
    "https://www.skhynix.com/"
  ],
  "timelines": [
    {
      "slug": "intel-foundry-18a",
      "title": "Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake",
      "url": "https://whatledto.com/events/intel-foundry-18a",
      "json": "https://whatledto.com/events/intel-foundry-18a.json",
      "role": "Held exploratory talks with Intel about possible use of the Ohio site for U.S. memory manufacturing, but said no decision had been made.",
      "entries": 2,
      "updated_at": "2026-10-22T03:14:17.271017+00:00"
    },
    {
      "slug": "nvidia-consumer-gpu-dlss",
      "title": "GeForce and DLSS: From the RTX 50 Launch to 3D-Guided Neural Rendering",
      "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss",
      "json": "https://whatledto.com/events/nvidia-consumer-gpu-dlss.json",
      "role": "Memory supplier cited in reporting on standard RTX 50 2GB GDDR7 supply.",
      "entries": 1,
      "updated_at": "2026-10-14T06:38:45.665711+00:00"
    },
    {
      "slug": "hbm-memory-supply",
      "title": "HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E",
      "url": "https://whatledto.com/events/hbm-memory-supply",
      "json": "https://whatledto.com/events/hbm-memory-supply.json",
      "role": "Moved from early HBM3E production to HBM4 mass shipments in 2026, sampled HBM4E, and is expanding packaging capacity in Korea and Indiana.",
      "entries": 18,
      "updated_at": "2026-10-14T05:44:42.508947+00:00"
    }
  ],
  "entries": [
    {
      "timeline": "hbm-memory-supply",
      "id": 1757,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1757",
      "date": "2026-09-23",
      "date_precision": "day",
      "title": "SK hynix displays NVIDIA Vera Rubin with 36GB HBM4",
      "summary": "SK hynix displayed NVIDIA's Vera Rubin superchip. The superchip was equipped with SK hynix's 12-layer 36GB HBM4 and 96GB SOCAMM2.",
      "type": "other",
      "entities": [
        "SK hynix",
        "Nvidia",
        "Vera Rubin"
      ],
      "parties": [
        "sk-hynix",
        "nvidia",
        "vera-rubin"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/tsmc-oip-conference-2026/",
          "outlet": "SK hynix Newsroom",
          "published": "2026-09-28",
          "quote": "“NVIDIA’s superchip ‘Vera Rubin,’ equipped with SK hynix’s 12-layer 36GB HBM4 and 96GB SOCAMM2”"
        }
      ]
    },
    {
      "timeline": "nvidia-consumer-gpu-dlss",
      "id": 1514,
      "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss#n1514",
      "date": "2026-09-22",
      "date_precision": "day",
      "title": "Reports say Micron moved away from 2GB GDDR7 for RTX 50 cards",
      "summary": "VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.",
      "type": "report",
      "entities": [
        "Micron",
        "GDDR7",
        "GeForce RTX 50 Series",
        "GeForce RTX 5060",
        "Samsung",
        "SK hynix",
        "GALAX",
        "VideoCardz",
        "Tom’s Hardware"
      ],
      "parties": [
        "micron",
        "gddr7",
        "geforce-rtx-50-series",
        "geforce-rtx-5060",
        "samsung",
        "sk-hynix",
        "galax",
        "videocardz",
        "toms-hardware"
      ],
      "sources": [
        {
          "url": "https://videocardz.com/newz/micron-reportedly-ends-production-of-2gb-gddr7-used-by-geforce-rtx-50",
          "outlet": "VideoCardz",
          "published": "2026-09-22",
          "quote": "“Micron appears to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.”"
        },
        {
          "url": "https://www.tomshardware.com/pc-components/ram/micron-discontinues-2gb-gddr7-chips-for-gaming-gpus-as-it-pivots-toward-higher-density-memory-for-ai-chipmaker-reportedly-pivots-to-high-margin-3gb-silicon-for-ai-gpus",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-24",
          "quote": "“Tom’s Hardware can confirm that the pages for module norms return ‘No results found.’”"
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1361,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1361",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "SK hynix says no decision has been made on reported Intel scenarios",
      "summary": "SK hynix said no decisions had been made regarding the two scenarios reported in the article. The statement addressed reported possible arrangements involving Intel and U.S. memory-chip production.",
      "type": "response",
      "entities": [
        "SK hynix",
        "Intel",
        "Intel Ohio One"
      ],
      "parties": [
        "sk-hynix",
        "intel",
        "intel-ohio-one"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/fact-10/",
          "outlet": "SK hynix Newsroom",
          "published": "2026-09-16",
          "quote": "No decisions have been made regarding the two scenarios mentioned in the article."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1360,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1360",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "Reuters reports possible SK hynix use of Intel's Ohio facility",
      "summary": "Reuters reported exploratory discussions between SK hynix and Intel about possible U.S. memory-chip manufacturing using Intel's Ohio site. One potential scenario described by Reuters' sources was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.",
      "type": "report",
      "entities": [
        "SK hynix",
        "Intel",
        "Intel Ohio One"
      ],
      "parties": [
        "sk-hynix",
        "intel",
        "intel-ohio-one"
      ],
      "sources": [
        {
          "url": "https://ca.marketscreener.com/news/sk-hynix-in-talks-with-intel-about-deal-to-make-memory-chips-in-the-us-for-the-first-time-sources-s-ce785bd2d881f52c",
          "outlet": "Reuters, via MarketScreener",
          "published": "2026-09-16",
          "quote": "Under one potential scenario, SK Hynix would lease part of Intel's long-planned chipmaking facility in Ohio, they said."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1358,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1358",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "SK hynix says no U.S. memory-production plan or arrangement is finalized",
      "summary": "SK hynix said it was exploring options to strengthen its global competitiveness. It said no specific plans or arrangements had been finalized.",
      "type": "response",
      "entities": [
        "SK hynix"
      ],
      "parties": [
        "sk-hynix"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/fact-10/",
          "outlet": "SK hynix Newsroom",
          "published": "2026-09-16",
          "quote": "“SK hynix is exploring various options to strengthen its global competitiveness, but no specific plans or arrangements have been finalized at this time.”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1357,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1357",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "Reuters reports SK hynix and Intel held U.S. memory manufacturing talks",
      "summary": "Reuters reported that SK hynix was holding exploratory discussions with Intel about manufacturing memory chips in the United States. One potential scenario was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.",
      "type": "report",
      "entities": [
        "SK hynix",
        "Intel"
      ],
      "parties": [
        "sk-hynix",
        "intel"
      ],
      "sources": [
        {
          "url": "https://m.investing.com/news/stock-market-news/exclusivesk-hynix-in-talks-with-intel-about-deal-to-make-memory-chips-in-the-us-for-the-first-time-sources-say-4902886?ampMode=1",
          "outlet": "Reuters (via Investing.com)",
          "published": "2026-09-16",
          "quote": "“Under one potential scenario, SK Hynix would lease part of Intel’s long-planned chipmaking facility in Ohio, they said.”"
        },
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-reportedly-discussing-us-memory-chip-manufacturing-with-intel-options-include-leasing-ohio-plant-or-forming-joint-venture-with-other-ai-hyperscalers",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-16",
          "quote": "“South Korean memory chip manufacturer SK hynix is in talks with Intel to start manufacturing inside the U.S., according to Reuters.”"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 770,
      "url": "https://whatledto.com/events/hbm-memory-supply#n770",
      "date": "2026-09-07",
      "date_precision": "day",
      "title": "TrendForce links Samsung's Q2 shipment growth to HBM4 ramp",
      "summary": "TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.",
      "type": "report",
      "entities": [
        "Samsung",
        "SK hynix",
        "Micron",
        "TrendForce"
      ],
      "parties": [
        "samsung",
        "sk-hynix",
        "micron",
        "trendforce"
      ],
      "sources": [
        {
          "url": "https://www.trendforce.com/presscenter/news/20260907-13219.html",
          "outlet": "TrendForce",
          "published": "2026-09-07",
          "quote": "TrendForce notes that Samsung posted the strongest QoQ bit shipment growth among the three major suppliers in 2Q26, supported by its early move into HBM4 mass production and shipments."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 159,
      "url": "https://whatledto.com/events/hbm-memory-supply#n159",
      "date": "2026-08-27",
      "date_precision": "day",
      "title": "SK hynix breaks ground on the Indiana HBM packaging plant, now over US$4 billion with production in 2029",
      "summary": "SK hynix held the groundbreaking ceremony for its West Lafayette, Indiana advanced packaging plant at Purdue University. The expected investment rose to over US$4 billion, the cleanroom is due by October 2028 and mass production of next-generation HBM in the second half of 2029, a year later than the 2028 target given in April 2024.",
      "type": "announcement",
      "entities": [
        "SK hynix",
        "State of Indiana"
      ],
      "parties": [
        "sk-hynix",
        "state-of-indiana"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/groundbreaking-ceremony-in-indiana/",
          "outlet": "SK hynix Newsroom",
          "published": "2026-08-28",
          "quote": "The Indiana fab, with a total expected investment of over $4 billion, is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 157,
      "url": "https://whatledto.com/events/hbm-memory-supply#n157",
      "date": "2026-07-29",
      "date_precision": "day",
      "title": "SK hynix says it began mass shipments of HBM4 in Q2 2026",
      "summary": "SK hynix said it began mass shipments of HBM4 in the second quarter of 2026. It said it would ramp production in the second half of the year.",
      "type": "shipment",
      "entities": [
        "SK hynix",
        "HBM4"
      ],
      "parties": [
        "sk-hynix",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/q2-2026-business-results/",
          "outlet": "SK hynix",
          "published": "2026-07-29",
          "quote": "The company began mass shipments of HBM4 in the second quarter and will ramp up production in the second half of the year."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 155,
      "url": "https://whatledto.com/events/hbm-memory-supply#n155",
      "date": "2026-06-18",
      "date_precision": "day",
      "title": "SK hynix ships 12-layer HBM4E samples to major customers",
      "summary": "SK hynix announced that it had shipped HBM4E samples to major customers. The samples were for a 12-layer HBM4E product.",
      "type": "shipment",
      "entities": [
        "SK hynix",
        "HBM4E",
        "HBM"
      ],
      "parties": [
        "sk-hynix",
        "hbm4e",
        "hbm"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/sk-hynix-ships-samples-of-12-layer-next-gen-hbm4e-2/",
          "outlet": "SK hynix",
          "published": "2026-06-18",
          "quote": "SK hynix announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 145,
      "url": "https://whatledto.com/events/hbm-memory-supply#n145",
      "date": "2026-01-08",
      "date_precision": "day",
      "title": "TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec",
      "summary": "TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of\n2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin\nspeed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand\nled Nvidia to adjust the Rubin production timeline.",
      "type": "report",
      "entities": [
        "TrendForce",
        "Nvidia",
        "SK hynix",
        "Samsung",
        "Micron",
        "HBM4"
      ],
      "parties": [
        "trendforce",
        "nvidia",
        "sk-hynix",
        "samsung",
        "micron",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://www.trendforce.com/presscenter/news/20260108-12869.html",
          "outlet": "TrendForce",
          "published": "2026-01-08",
          "quote": "Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This change has necessitated that the three major HBM suppliers modify their designs."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 152,
      "url": "https://whatledto.com/events/hbm-memory-supply#n152",
      "date": "2025-09-24",
      "date_precision": "day",
      "title": "Counterpoint reports SK hynix and Samsung held 79% of Q2 HBM shipments",
      "summary": "Counterpoint Research reported that SK hynix held 62% and Samsung Electronics held 17% of global HBM shipment share in the second quarter of 2025. The reported combined share was about 79%.",
      "type": "report",
      "entities": [
        "Counterpoint Research",
        "SK hynix",
        "Samsung",
        "HBM"
      ],
      "parties": [
        "counterpoint-research",
        "sk-hynix",
        "samsung",
        "hbm"
      ],
      "sources": [
        {
          "url": "https://korea.counterpointresearch.com/2025-q2-hbm-market-shipments-share/",
          "outlet": "Counterpoint Research",
          "published": null,
          "quote": "2025년 2분기 전세계 HBM 시장에서 SK하이닉스와 삼성전자가 출하량 기준 점유율 62%, 17%를 기록하며, 이로써 K-HBM이 전체 시장의 약 79% 차지"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 144,
      "url": "https://whatledto.com/events/hbm-memory-supply#n144",
      "date": "2025-09-12",
      "date_precision": "day",
      "title": "SK hynix completes HBM4 development and says its mass-production system is ready",
      "summary": "SK hynix announced it had completed HBM4 development and finished preparing mass production, the first\nsupplier to claim both, on the schedule it set in March.",
      "type": "announcement",
      "entities": [
        "SK hynix",
        "HBM4"
      ],
      "parties": [
        "sk-hynix",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/sk-hynix-completes-worlds-first-hbm4-development-and-readies-mass-production/",
          "outlet": "SK hynix Newsroom",
          "published": "2025-09-12",
          "quote": "SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high performance AI, mass production for the world's first time."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1481,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1481",
      "date": "2025-06",
      "date_precision": "month",
      "title": "West Lafayette residents challenge rezoning for SK hynix plant",
      "summary": "Three West Lafayette residents filed lawsuits in Tippecanoe County Circuit Court. The lawsuits sought to void a rezoning ordinance adopted by the West Lafayette City Council.",
      "type": "legal",
      "entities": [
        "SK hynix",
        "West Lafayette City Council",
        "Tippecanoe County Circuit Court"
      ],
      "parties": [
        "sk-hynix",
        "west-lafayette-city-council",
        "tippecanoe-county-circuit-court"
      ],
      "sources": [
        {
          "url": "https://www.sec.gov/Archives/edgar/data/2120882/000119312526299963/d32785d424b4.htm",
          "outlet": "SK hynix",
          "published": "2026-07-09",
          "quote": "In June 2025, three residents of West Lafayette, Indiana filed lawsuits in the Tippecanoe County Circuit Court seeking to void a re-zoning ordinance adopted by the West Lafayette City Council."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 142,
      "url": "https://whatledto.com/events/hbm-memory-supply#n142",
      "date": "2025-04-16",
      "date_precision": "day",
      "title": "JEDEC publishes the HBM4 standard, doubling channels per stack to 32",
      "summary": "JEDEC released JESD270-4, the HBM4 standard, which doubles independent channels per stack from 16 to 32\nwith two pseudo-channels each, keeps backward compatibility with HBM3 controllers and adds directed refresh\nmanagement. SK hynix, AMD, Synopsys and Cadence gave statements.",
      "type": "announcement",
      "entities": [
        "JEDEC",
        "SK hynix",
        "AMD",
        "HBM4"
      ],
      "parties": [
        "jedec",
        "sk-hynix",
        "amd",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://www.jedec.org/news/pressreleases/jedec%C2%AE-and-industry-leaders-collaborate-release-jesd270-4-hbm4-standard-advancing",
          "outlet": "JEDEC",
          "published": "2025-04-16",
          "quote": "Doubled Channels: HBM4 doubles the number of independent channels per stack, from 16 channels (HBM3) to 32 channels with 2 pseudo-channels per channel."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 141,
      "url": "https://whatledto.com/events/hbm-memory-supply#n141",
      "date": "2025-03-19",
      "date_precision": "day",
      "title": "SK hynix ships the first 12-layer HBM4 samples, targets mass-production readiness in the second half of 2025",
      "summary": "SK hynix said it had shipped 12-layer HBM4 samples to major customers, the first supplier to do so, and\naimed to complete mass-production preparations within the second half of 2025.",
      "type": "announcement",
      "entities": [
        "SK hynix",
        "HBM4"
      ],
      "parties": [
        "sk-hynix",
        "hbm4"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/sk-hynix-ships-world-first-12-layer-hbm4-samples-to-customers/",
          "outlet": "SK hynix Newsroom",
          "published": "2025-03-19",
          "quote": "SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 158,
      "url": "https://whatledto.com/events/hbm-memory-supply#n158",
      "date": "2024-09-26",
      "date_precision": "day",
      "title": "SK hynix starts mass production of the first 12-layer 36GB HBM3E",
      "summary": "SK hynix said it had begun mass production of the world's first 12-layer HBM3E with 36GB, running at 9.6 Gbps, with 3GB dies each 40 percent thinner than before, and planned to supply the product to customers within the year.",
      "type": "launch",
      "entities": [
        "SK hynix",
        "HBM3E"
      ],
      "parties": [
        "sk-hynix",
        "hbm3e"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/sk-hynix-begins-volume-production-of-the-world-first-12-layer-hbm3e/",
          "outlet": "SK hynix Newsroom",
          "published": "2024-09-26",
          "quote": "The company plans to supply mass-produced products to customers within the year"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 140,
      "url": "https://whatledto.com/events/hbm-memory-supply#n140",
      "date": "2024-08-06",
      "date_precision": "day",
      "title": "Commerce offers SK hynix up to US$450 million in CHIPS funding for the Indiana plant",
      "summary": "SK hynix signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce for up\nto US$450 million in proposed direct funding and US$500 million in loans under the CHIPS and Science Act\nfor the Indiana packaging facility.",
      "type": "regulatory",
      "entities": [
        "SK hynix",
        "U.S. Department of Commerce"
      ],
      "parties": [
        "sk-hynix",
        "us-department-of-commerce"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/preliminary-mou-terms-signed-with-us-doc-for-advanced-packaging-facility-in-indiana/",
          "outlet": "SK hynix Newsroom",
          "published": "2024-08-06",
          "quote": "SK hynix Inc. announced today it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to $450 million in proposed direct funding and access to proposed loans of $500 million as part of the CHIPS and Science Act"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 139,
      "url": "https://whatledto.com/events/hbm-memory-supply#n139",
      "date": "2024-04-24",
      "date_precision": "day",
      "title": "SK hynix to build the M15X fab in Cheongju for HBM, about 5.3 trillion won, complete by November 2025",
      "summary": "SK hynix said it would invest about 5.3 trillion won to build M15X in Cheongju as a new DRAM base focused\non HBM, targeting completion in November 2025 for early mass production, next to the M15 plant where TSV\ncapacity was being expanded.",
      "type": "announcement",
      "entities": [
        "SK hynix"
      ],
      "parties": [
        "sk-hynix"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/sk-hynix-to-produce-dram-from-m15x-in-cheongju/",
          "outlet": "SK hynix Newsroom",
          "published": "2024-04-24",
          "quote": "increasing DRAM capabilities with a focus on HBM is a precondition for future growth."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 138,
      "url": "https://whatledto.com/events/hbm-memory-supply#n138",
      "date": "2024-04-03",
      "date_precision": "day",
      "title": "SK hynix commits US$3.87 billion to an HBM packaging plant in Indiana",
      "summary": "SK hynix signed an agreement with the state of Indiana to build an advanced packaging and R&D facility in\nWest Lafayette for AI memory, with mass production planned for the second half of 2028, the first HBM\npackaging plant announced in the United States.",
      "type": "announcement",
      "entities": [
        "SK hynix",
        "State of Indiana"
      ],
      "parties": [
        "sk-hynix",
        "state-of-indiana"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/sk-hynix-signs-investment-agreement-of-advanced-chip-packaging-with-indiana/",
          "outlet": "SK hynix Newsroom",
          "published": "2024-04-03",
          "quote": "The company plans to begin mass production in the second half of 2028"
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 137,
      "url": "https://whatledto.com/events/hbm-memory-supply#n137",
      "date": "2024-03-19",
      "date_precision": "day",
      "title": "SK hynix begins volume production of HBM3E, supplying a customer from late March",
      "summary": "SK hynix said it had begun volume production of HBM3E for supply to a customer from late March 2024. It\ndid not name the customer; the announcement came the day after Nvidia's GTC keynote.",
      "type": "launch",
      "entities": [
        "SK hynix",
        "Nvidia",
        "HBM3E"
      ],
      "parties": [
        "sk-hynix",
        "nvidia",
        "hbm3e"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/sk-hynix-begins-volume-production-of-industry-first-hbm3e/",
          "outlet": "SK hynix Newsroom",
          "published": "2024-03-19",
          "quote": "SK hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer from late March."
        }
      ]
    }
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