Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake

Ohio One gets its first major truss, on a site Intel had pushed to 2030

Intel said the first major structural truss had been installed on the first fab at its Ohio One site in New Albany, and CNBC reported that the next stage of construction "has finally begun". Intel delayed Ohio One Mod 1 completion to 2030 in February 2025 and slowed the site again that July, so this is physical progress on the part of the build that had stopped moving.

• Intel · Oct 21, 2026 · We’re also making progress in Ohio, where the first major structural truss has been installed on the first fab in New Albany.
• CNBC · Oct 21, 2026 · On Wednesday, Intel announced that crews have installed the first major structural truss in Ohio, which means the next part of the construction has finally begun.

Editor's note: Intel’s page states that the first major structural truss was installed on the first fab in New Albany and identifies the site as Ohio One. CNBC reports that Intel announced the installation on Oct. 21, 2026, and says it marked the beginning of the next part of construction.

Tan says Intel will continue Terafab involvement

Intel CEO Lip-Bu Tan said Intel would continue its involvement in Terafab. Bloomberg reported the statement before an Intel event in Tokyo.

• Bloomberg via Moneycontrol · Oct 7, 2026 · Intel will continue its involvement in Terafab, Tan told Bloomberg prior to an event in Tokyo commemorating the US company’s 50th year of operations in Japan.

Editor's note: The cited Moneycontrol/Bloomberg page states that Intel CEO Lip-Bu Tan said Intel would continue its involvement in Terafab and that he told Bloomberg before an event in Tokyo. The page is dated October 7, 2026 and identifies Tan in Tokyo on October 7.

SemiAnalysis finds similar density for Panther Lake 18A and TSMC N3E logic

SemiAnalysis reported that its measurements found similar logic density between Panther Lake’s Intel 18A compute logic and TSMC N3E GPU logic. Notebookcheck reported the same SemiAnalysis finding.

• SemiAnalysis · Sep 26, 2026 · Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density.
• Notebookcheck · Sep 27, 2026 · SemiAnalysis measured Panther Lake’s 18A compute logic and found that it has roughly the same density as the GPU logic manufactured on TSMC’s N3E process.

Editor's note: The page states that its measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. It is dated Sep 26, 2026, matching the node date.

Intel Foundry chief expects Intel 14A within 5% of TSMC A14 performance

Tom’s Hardware reported that Intel Foundry chief Naga Chandrasekaran told KeyBanc that Intel 14A was expected to deliver performance within 5% of TSMC A14. The report did not specify whether Intel 14A was expected to be faster or slower than TSMC A14.

• Tom’s Hardware · Sep 25, 2026 · Intel's 14A (1.4nm-class) process technology is expected to deliver performance 'within 5%' of TSMC's A14 (1.4nm-class) production node, Naga Chandrasekaran, the chief technology and operations officer as well as general manager of Intel Foundry, told investment banking firm KeyBanc (via @Alex_Intel).

Editor's note: The article explicitly says Naga Chandrasekaran told KeyBanc that Intel 14A should be "within 5%" of TSMC A14, and explains that this does not indicate which node would be faster. The readable page text does not provide a publication or event date supporting 2026-09-25.

Intel Penang packaging facility scheduled to begin operations in 2026

Tech Wire Asia reported that Intel’s new advanced-packaging facility in Penang was scheduled to begin operations in 2026. The report cited Lee Wei Chern, Intel Foundry vice president and Intel Malaysia managing director, as saying the facility would expand Malaysian capabilities in advanced packaging, assembly, test, research and design.

• Tech Wire Asia · Sep 24, 2026 · “Intel’s new advanced packaging facility in Penang, scheduled to begin operations this year, will expand the company’s manufacturing capabilities in Malaysia.”
• Intel Newsroom · Sep 16, 2024 · “We plan to complete the construction of our new advanced packaging factory in Malaysia but will align the startup with market conditions and increased utilization of our existing capacity.”

Editor's note: The page states that Intel’s Penang advanced-packaging facility was scheduled to begin operations “this year” and quotes Lee Wei Chern saying it would expand capabilities across advanced packaging, assembly, test, research and design. The article is dated 2026-09-24, but it does not state that facility operations would begin on that specific date.

SK hynix says no decision has been made on reported Intel scenarios

SK hynix said no decisions had been made regarding the two scenarios reported in the article. The statement addressed reported possible arrangements involving Intel and U.S. memory-chip production.

• SK hynix Newsroom · Sep 16, 2026 · No decisions have been made regarding the two scenarios mentioned in the article.

responded to Reuters reports possible SK hynix use of Intel's Ohio facility. responded to Reuters reports SK hynix and Intel held U.S. memory manufacturing talks on HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E.

Editor's note: The page states that no decisions had been made regarding the two reported scenarios and clarifies that nothing was finalized concerning Intel or U.S. memory-chip production. It identifies the underlying report as published on September 16, 2026.

Reuters reports possible SK hynix use of Intel's Ohio facility

Reuters reported exploratory discussions between SK hynix and Intel about possible U.S. memory-chip manufacturing using Intel's Ohio site. One potential scenario described by Reuters' sources was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.

• Reuters, via MarketScreener · Sep 16, 2026 · Under one potential scenario, SK Hynix would lease part of Intel's long-planned chipmaking facility in Ohio, they said.

was answered by SK hynix says no decision has been made on reported Intel scenarios. was answered by SK hynix says no U.S. memory-production plan or arrangement is finalized on HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E.

Editor's note: The Reuters article says SK Hynix was in exploratory talks with Intel regarding U.S. memory-chip manufacturing and specifically describes a scenario in which it would lease part of Intel's planned Ohio facility. It is published on 2026-09-16 and datelined September 16.

Intel Foundry and ASML report one million High-NA EUV wafers

Intel Foundry and ASML reported that High-NA EUV had processed more than one million wafers cumulatively. Intel said the total included tool certification, research and development, and production on select Panther Lake layers. Intel said overlay, throughput, and availability met its expectations.

• Intel Newsroom · Sep 7, 2026 · Overlay, throughput and availability are meeting Intel Foundry's expectations.
• Tom’s Hardware · Sep 8, 2026 · Intel's one million wafers figure includes wafers processed during tool installation and certification, R&D, and production.

Editor's note: The page states that more than one million wafers had been processed across tool certification/testing, R&D, and volume production on select Panther Lake layers. It gives the event date as September 7, 2026 and says overlay, throughput, and availability are meeting Intel Foundry's expectations.

Intel raises US$20 billion in a stock offering priced at US$95 a share

Intel priced an underwritten public offering of 210,526,315 shares at US$95 each, raising US$20 billion after upsizing the deal from the US$15 billion announced two days earlier. The price is more than four times the US$20.47 the U.S. government paid per share in August 2025.

• Intel Newsroom · Aug 12, 2026 · Intel priced the underwritten public offering of 210,526,315 shares of common stock at a public offering price of $95 per share.
• Intel Newsroom · Aug 10, 2026 · Intel Corporation (Nasdaq: INTC) today announced a $15 billion underwritten public offering of common stock.

Editor's note: Both Intel newsroom releases (Aug 10 and Aug 12, 2026) fetched and quoted directly.

Intel Foundry completes the RAMP-C program

Intel Foundry announced completion of the Rapid Assured Microelectronics Prototypes - Commercial program. The announcement identified the program as RAMP-C.

• Intel Newsroom · Jul 28, 2026 · Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.

Editor's note: The Intel page states that Intel Foundry completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program and contains the quoted sentence. It is dated July 28, 2026.

Intel Foundry segment revenue reaches US$5.8 billion, up 31 percent

Second-quarter 2026 results showed Intel Foundry segment revenue of US$5.8 billion, up 31 percent from a year earlier, against total company revenue of US$16.1 billion. Segment revenue includes wafers made for Intel's own product groups, so the figure measures foundry activity rather than external customer sales.

• Intel Q2 2026 results (SEC exhibit) · Jul 23, 2026 · Intel Foundry 5.8 billion up 31%

Editor's note: Figures taken from the segment table in the Q2 2026 earnings release filed with the SEC on July 23, 2026.

Intel and Fortinet collaborate on Security Processor 6

Intel and Fortinet announced a strategic collaboration to develop Fortinet Security Processor 6. The announcement identified the product as SP6.

• Intel Newsroom · Jul 21, 2026 · Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6).

Editor's note: The page states that Intel and Fortinet announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6). It is dated July 21, 2026, matching the node date.

Intel Foundry establishes advanced packaging as a focused business

Intel said it was establishing advanced packaging as a focused Intel Foundry business. The business would have dedicated leadership.

• Intel Newsroom · Jun 18, 2026 · As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership.

Editor's note: The Intel page states that the company is establishing advanced packaging as a focused Intel Foundry business with dedicated leadership. It is dated June 18, 2026.

Intel 18A-P enters risk production

Intel Foundry said Intel 18A-P entered risk production. Intel described 18A-P as the first performance enhancement in the Intel 18A family.

• Intel Newsroom · Jun 16, 2026 · It shared that Intel 18A-P, the first performance enhancement in the Intel 18A family, has entered risk production, meeting the timeline first shared with customers and partners last year.

Editor's note: The Intel page states that Intel 18A-P, described as the first performance enhancement in the Intel 18A family, entered risk production. It is dated June 16, 2026.

Intel becomes sole owner of the Fab 34 joint venture

Intel completed the repurchase of Apollo's interest in the Fab 34 joint venture. Intel owned 100% of the joint venture after the repurchase.

• Intel Form 8-K · Apr 8, 2026 · Intel owns 100% of the joint venture following the repurchase.

Editor's note: The filing states that on April 8, 2026, Intel repurchased Apollo-managed funds' and affiliates' 49% interest in the Fab 34 joint venture. It also states that Intel owns 100% of the joint venture following the repurchase.

Intel joins the Terafab project

Intel announced it had joined the Terafab project alongside SpaceX, xAI and Tesla. An Intel filing later described Intel as a strategic Terafab partner.

• Tom’s Hardware · Apr 7, 2026 · Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology
• Intel Corporation Form 8-K · Apr 23, 2026 · Intel joined the Terafab project as a strategic partner alongside SpaceX, xAI, and Tesla.
• Intel · Apr 23, 2026 · We recently announced our partnership with SpaceX, xAI and Tesla to support Terafab.

Editor's note: Source 1 reports Intel's April 7, 2026 announcement that it joined Terafab with SpaceX, xAI, and Tesla. Source 2, an April 23, 2026 Intel 8-K attachment, later describes Intel as a strategic Terafab partner alongside those companies. Official source added: https://download.intel.com/newsroom/2026/earnings/1Q2026-Earnings-Call.pdf

Intel agrees to repurchase Apollo's Fab 34 venture stake

Intel and Apollo agreed that Intel would repurchase the 49% interest in the Fab 34 joint venture that Intel did not own. The agreed purchase price was US$14.2 billion.

• Intel Newsroom · Apr 1, 2026 · Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) today announced a definitive agreement for Intel to repurchase the 49% equity interest in the joint venture related to Intel’s Fab 34 in Ireland not held by Intel for $14.2 billion.

Editor's note: The Intel newsroom page states that Intel and Apollo agreed for Intel to repurchase Apollo's 49% Fab 34 joint-venture interest for $14.2 billion. It is dated April 1, 2026, and contains the quoted sentence.

Intel unveils Core Ultra Series 3 built on Intel 18A

Intel unveiled Core Ultra Series 3 processors at CES. Intel described the processors as its first AI PC platform built on Intel 18A and designed and manufactured in the United States.

• Intel Newsroom · Jan 5, 2026 · Today at CES, Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States.

Editor's note: The page states that Intel unveiled Intel Core Ultra Series 3 at CES and describes it as the first AI PC platform built on Intel 18A process technology designed and manufactured in the United States. It is dated January 5, 2026.

Nvidia invests US$5 billion in Intel; the two will build custom x86 CPUs and RTX-based PC chips

Nvidia agreed to buy US$5 billion of Intel stock at US$23.28 a share. Intel will build Nvidia-custom x86 CPUs for Nvidia's data center platforms and x86 system-on-chips with Nvidia RTX GPU chiplets for PCs, connected with NVLink.

• Intel Newsroom · Sep 18, 2025 · For data centers, Intel will build NVIDIA-custom x86 CPUs that NVIDIA will integrate into its AI infrastructure platforms and offer to the market.

Fab 52 processes its first Intel 18A wafer

Fab 52 in Arizona processed its first wafer through the facility. Intel said the wafer was an Intel 18A wafer.

• Intel Newsroom · Apr 29, 2025 · Fab 52 in Arizona has successfully “run the lot,” marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers.

Editor's note: The Intel page states that Fab 52 in Arizona had successfully “run the lot,” marking the first wafer processed through the facility and demonstrating progress for leading-edge Intel 18A wafers. The page is dated April 29, 2025.

Intel Foundry engages lead customers on Intel 14A

Intel Foundry said it had engaged lead customers on its Intel 14A process technology. Intel described 14A as the successor to Intel 18A.

• Intel Newsroom · Apr 29, 2025 · Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A.

Editor's note: The page states that Intel Foundry engaged lead customers on Intel 14A and explicitly calls it the successor to Intel 18A. It is dated April 29, 2025.

Lip-Bu Tan appointed Intel CEO

Intel's board appointed Lip-Bu Tan, former CEO of Cadence Design Systems, as chief executive effective March 18, 2025, succeeding the interim co-CEOs.

• Intel Newsroom · Mar 12, 2025 · Intel Corporation (Nasdaq: INTC) today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.

led to Intel cancels Germany and Poland fabs, slows Ohio, and makes 14A conditional on an outside customer.

Intel delays Ohio One Mod 1 completion to 2030

Intel said it planned to complete Ohio One Mod 1 construction in 2030. It said operations would begin between 2030 and 2031.

• Intel Newsroom · Feb 28, 2025 · Specifically, we now plan to complete construction of Mod 1 in 2030 and begin operations between 2030 and 2031.

Editor's note: The Intel page is dated February 28, 2025, and states that Mod 1 construction is planned for completion in 2030, with operations beginning between 2030 and 2031. The quoted sentence appears on the page.

Intel Foundry adds two customers to RAMP-C phase three

Intel Foundry added Trusted Semiconductor Solutions and Reliable MicroSystems to the third phase of RAMP-C. The customers were added under the Trusted & Assured Microelectronics Program.

• Intel Newsroom · Jan 17, 2025 · Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)).

Editor's note: The Intel Newsroom page states that Trusted Semiconductor Solutions and Reliable MicroSystems were onboarded as new DIB customers in the third phase of RAMP-C under the T&AM Program. It is dated January 17, 2025, and the quoted text appears on the page.

Pat Gelsinger retires; two interim co-CEOs take over

Intel said Gelsinger had retired and left the board effective December 1, 2024, and named CFO David Zinsner and product chief Michelle Johnston Holthaus as interim co-chief executives while the board searched for a successor.

• Intel Newsroom · Dec 2, 2024 · Intel has named two senior leaders, David Zinsner and Michelle (MJ) Johnston Holthaus, as interim co-chief executive officers while the board of directors conducts a search for a new CEO.

Intel 18A powers on first client and server chips; PDK 1.0 released to customers

Intel said the first 18A products, the Panther Lake client chip and Clearwater Forest server chip, had powered on and were healthy, that 18A remained on track for production in 2025, and that the 18A Process Design Kit 1.0 had been released in July so outside customers could start designs.

• Intel Newsroom · Aug 6, 2024 · Intel 18A powered on and healthy, on track for next-gen client and server chip production next year.

Commerce proposes up to US$8.5 billion in CHIPS Act funding for Intel, plus up to US$11 billion in loans

Intel and the Biden administration announced preliminary terms for up to US$8.5 billion in direct CHIPS Act funding for projects in Arizona, New Mexico, Ohio and Oregon, eligibility for federal loans of up to US$11 billion, and an investment tax credit on more than US$100 billion of qualified investment.

• Intel Newsroom · Mar 20, 2024 · has proposed up to $8.5 billion in direct funding through the CHIPS and Science Act to advance Intel’s commercial semiconductor projects in Arizona, New Mexico, Ohio and Oregon.

Intel sets internal-foundry model for first quarter of 2024

Intel said a new manufacturing group segment would be included in reportable P&Ls beginning in the first quarter of 2024. The segment would include manufacturing, technology development, and Intel Foundry Services.

• Intel Newsroom · Jun 21, 2023 · Beginning in Q1 2024, the reportable P&Ls will include a new manufacturing group segment – inclusive of manufacturing, technology development and Intel Foundry Services (IFS) – along with the company’s product groups – Client Computing, Data Center and AI, Network and Edge, and All Other.

Editor's note: The Intel page is dated June 21, 2023 and states that, beginning in Q1 2024, reportable P&Ls would include a new manufacturing group segment covering manufacturing, technology development, and Intel Foundry Services. The quoted text appears on the page.

Intel and Germany agree expanded Magdeburg fab investment

Intel and the German federal government signed a revised letter of intent for two fabs in Magdeburg. Intel said the investment was expected to exceed €30 billion and would receive increased government incentives.

• Intel Newsroom · Jun 19, 2023 · The agreement encompasses Intel’s expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities (also known as “fabs”) in Europe, along with increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced.

Editor's note: The Intel Newsroom page states that Intel and the German federal government signed a revised letter of intent for the Magdeburg site, with investment expected to exceed €30 billion and increased government incentives. It is dated June 19, 2023, and the quoted text appears on the page.

Intel breaks ground on Fab 52 and Fab 62 in Arizona

Intel held a groundbreaking ceremony for Fab 52 and Fab 62 at its Ocotillo campus in Chandler, Arizona. Intel put the two-fab project cost at $20 billion.

• Intel Newsroom · Nov 26, 2024 · Intel CEO Pat Gelsinger was joined by government and community leaders on Sept. 24, 2021, for a groundbreaking ceremony on the factories: Fab 52 and Fab 62.

Editor's note: The page states that Pat Gelsinger joined government and community leaders on Sept. 24, 2021, for the Fab 52 and Fab 62 groundbreaking at Intel's Ocotillo campus in Chandler, Arizona. It also states the project price tag was $20 billion.

Defense Department awards Intel phase-one RAMP-C agreement

The U.S. Department of Defense awarded Intel an agreement for the first phase of the RAMP-C program. Intel Foundry Services was designated to lead the work.

• Intel Newsroom · Aug 23, 2021 · The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.

Editor's note: The Intel page states that the Department of Defense awarded Intel an agreement for the first phase of RAMP-C and that Intel Foundry Services would lead the work. It is dated August 23, 2021, and contains the quoted text.