TSMC

Apple said TSMC Arizona produced more than 100 million chips for Apple during 2026. Apple said the chips were used in iPhone, iPad, and Apple Watch products.

TSMC said construction of its second Arizona fab was complete with tool move-in and installation under way, and put N3 volume production in the third quarter of 2027 — "slightly ahead of our previous schedule". That resolves the conflict this page recorded on 5 October, when a TSMC careers page put Fab 2 at 2028 while the earnings call pointed at 2027.

A TSMC Arizona job posting described the second fab as using N3 and N2 and being operational in 2028. On the January 2026 earnings call the company said it was pulling the schedule forward and expected high-volume manufacturing in the second half of 2027. The two are a year apart, and only one of them is a commitment the company made to investors.

SemiAnalysis reported that its measurements found similar logic density between Panther Lake’s Intel 18A compute logic and TSMC N3E GPU logic. Notebookcheck reported the same SemiAnalysis finding.

OpenAI CFO Sarah Friar said the company needs multiple providers to manage supply-chain risk. She cited the possibility that a supplier, including TSMC, might not provide needed capacity.

Advanced Micro Devices said it expected its Data Center business to double in 2027 to about $70 billion in sales. The company said it had undertaken supply-chain work to support doubling Data Center revenue the following year. Su added that all three anchor customers for MI450 and Helios had given forecasts above AMD's initial expectations, and that AMD was working with suppliers to support them.

Bloomberg reported that 12 units of Meta's new model arrived from TSMC on September 1. The report said their performance was within 2% to 3% of Meta's simulations.

Citing TSMC's first-half 2026 interim report, Commercial Times and the Economic Daily News reported that TSMC Arizona posted a record NT$36.066 billion profit, up 662.8 percent year on year, overtaking TSMC Nanjing as the company's most profitable overseas subsidiary. The Arizona unit contributed more than 60 percent of the NT$58.529 billion earned by TSMC's four main manufacturing subsidiaries. Second-quarter profit slipped 8.2 percent from the first quarter to NT$17.259 billion as depreciation mounted, and Commercial Times put TSMC's second-quarter investment income from the U.S. fab at about NT$14.603 billion, down 13.6 percent from NT$16.909 billion. TaiwanPlus put the half-year figure at around US$1.1 billion.

The Information reported that Microsoft was targeting a public unveiling of Maia 300 as soon as September and negotiating TSMC capacity for more than 300,000 units in 2027, an order dwarfing the tens of thousands of Maia 200 chips built so far, with a longer-term aim of more than a million. Maia 200 had been delayed after early tests missed targets and was running in only a few data centers; Nadella had told investors on July 29 it delivered 30 percent better performance per dollar.

Alongside second-quarter 2026 results, chairman C.C. Wei said TSMC would invest an additional US$100 billion in Arizona to build several more wafer fabs for 2-nanometer and below technologies plus advanced packaging fabs, bringing the state total to US$265 billion. Wei said there was a plan but no firm schedule for the new sites.

Taiwan's Ministry of Economic Affairs approved TSMC's US$20 billion capital injection into TSMC Arizona. The funding was designated for a 12-inch wafer fab and an advanced-packaging plant in Arizona.

At GTC Taipei ahead of Computex, Nvidia said hundreds of supply chain partners across more than 350 factories in 30 countries were ramping Vera Rubin, with production shipments to begin in the fall.

TSMC's board approved a capital injection of no more than US$20 billion into TSMC Arizona. The authorization was disclosed in a Form 6-K filing with the U.S. Securities and Exchange Commission.

TSMC Arizona held a topping-out ceremony for Fab 3 with Phoenix Mayor Kate Gallego and TSMC Arizona executives. TSMC Arizona said it celebrated the topping of its third fab in May.

TSMC started initial construction on its fourth Arizona fab and first advanced-packaging plant. The City of Phoenix reported that TSMC announced the start during the preceding month.

TSMC told EE Times that all of its advanced packaging was in Taiwan. TSMC planned two advanced-packaging facilities at its Arizona site.

Apple said it was on track to purchase well over 100 million advanced chips produced by TSMC at its Arizona facility in 2026. Apple said this would be an increase from 2025.

TSMC said it had completed the purchase of a second large parcel near its Arizona site. The company said the land would support its expansion plan and provide flexibility for multiyear AI-related demand.

On the fourth-quarter 2025 call, TSMC said it was pulling forward existing fab schedules in Taiwan and Arizona, that Arizona yields and defect density were almost equal to Taiwan, and that the plan would scale an independent gigafab cluster in Arizona with around 30 percent of 2nm-and-more-advanced capacity.

On the second-quarter 2025 call, CEO C.C. Wei said construction of the second Arizona fab, for 3nm, was complete and its volume production schedule was being sped up by several quarters. Work on the third fab, for 2nm and A16, had begun. Wei said about 30 percent of TSMC's 2nm-and-smaller capacity would eventually be in Arizona.

TSMC broke ground on its third Phoenix fab on April 29, 2025, with Commerce Secretary Howard Lutnick attending. TSMC's Arizona site page says the fab is slated for N2 and A16 process technologies.

TSMC said its third and fourth Arizona fabs would use N2 and A16 process technologies. It said construction was scheduled to begin later in 2025, subject to receiving permits.

TSMC said construction of its second Arizona fab was already complete. It said the fab would use 3-nanometer process technologies and that the company was speeding up its volume-production schedule.

AMD announced successful bring-up and validation of its fifth-generation EPYC CPU products at TSMC's new Arizona fabrication facility. AMD said the result underscored its commitment to US manufacturing.

NVIDIA announced that Blackwell chips had started production at TSMC chip plants in Phoenix, Arizona. The statement identified the production location as TSMC's Phoenix plants.

Announced at the White House with President Trump, the expansion took TSMC's planned U.S. investment from US$65 billion to US$165 billion, covering three additional fabs, two advanced packaging facilities and a major R&D team center in Arizona.

TSMC has said its first Arizona fab has been in volume production since late 2024, on the N4 process, a few months ahead of the first-half-2025 target set in April 2024. TSMC gives the timing as late 2024 or the fourth quarter; no exact date has been published.

The U.S. Department of Commerce said early production yields at TSMC’s first Arizona plant were on par with similar factories in Taiwan. The statement concerned early Fab 1 production yields.

The U.S. Department of Commerce finalized a CHIPS Act award of up to US$6.6 billion in direct funding for TSMC Arizona. Commerce said the award supports TSMC’s planned investment of more than US$65 billion in three Phoenix fabs.

Bloomberg reported that usable-chip yield at TSMC's Phoenix facility was about four percentage points higher than at comparable facilities in Taiwan. The report attributed the statement to TSMC US division president Rick Cassidy during a webinar.

TSMC’s board authorized a capital injection of up to US$7.5 billion into TSMC Arizona. The resolution identifies TSMC Arizona as a wholly owned TSMC subsidiary.

Citing The Information, The Register reported that Nvidia had told Microsoft of delays to the most advanced Blackwell parts, with volume shipments pushed to the first quarter of 2025 and TSMC's CoWoS packaging suspected as the cause. Nvidia's statement did not confirm a delay: it said sampling had started and production was on track to ramp in the second half.

TSMC Arizona and the U.S. Department of Commerce announced a preliminary agreement for up to US$6.6 billion in direct CHIPS Act funding. TSMC added a third Phoenix fab for 2nm or more advanced processes by the end of the decade, taking the site to more than US$65 billion. The first fab was described as on track for 4nm production in the first half of 2025, and the second fab was now to produce 2nm as well as 3nm, with production beginning in 2028 rather than 2026.

TSMC said its first Arizona fab entered engineering-wafer production in April using N4 process technology. The statement concerned engineering-wafer production.

Nvidia announced the Blackwell architecture in San Jose, listing the B200 Tensor Core GPU and the GB200 Grace Blackwell Superchip, which pairs two B200 GPUs with a Grace CPU. The release claims up to 25x lower cost and energy for LLM inference compared with H100.

TSMC’s board authorized a capital injection of up to US$5 billion into TSMC Arizona. TSMC Arizona is a wholly owned TSMC subsidiary.

TSMC said its current planning placed Fab 2 production in 2027 or 2028. It said the process-technology choice remained undecided.

TSMC’s board authorized a capital injection of up to US$4.5 billion into TSMC Arizona. The resolution identifies TSMC Arizona as a wholly owned TSMC subsidiary.

On its second-quarter 2023 earnings call, TSMC chairman Mark Liu said the Arizona fab lacked enough workers with the expertise needed to install equipment, and that N4 production would be pushed from 2024 to 2025. TSMC said it was sending experienced technicians from Taiwan to train local staff.

TSMC’s board authorized a capital injection of up to US$3.5 billion into TSMC Arizona. TSMC Arizona is a wholly owned TSMC subsidiary.

TSMC said construction costs for building and facility work could be four to five times higher for a US fab than for a fab in Taiwan. It said construction costs were a major reason for the cost gap.

At the ceremony marking the arrival of manufacturing equipment, attended by President Biden, TSMC said the first fab would begin N4 production in 2024 and that construction of a second fab had started, with 3nm production scheduled for 2026. The two fabs together were put at about US$40 billion.

Nvidia introduced Hopper, the successor to Ampere, with the H100 as its first GPU. The press release cites 80 billion transistors on a TSMC 4N process and says the H100 will be available in the third quarter.

TSMC said it had started construction at an Arizona site for a computer-chip factory. The company planned to spend US$12 billion on the facility.

TSMC said it intended to build and operate an advanced fab in the United States with support from the federal government and the State of Arizona: 5-nanometer technology, 20,000 wafers a month, over 1,600 jobs, about US$12 billion of spending from 2021 to 2029, construction from 2021 and production in 2024.