Intel

Intel said the first major structural truss had been installed on the first fab at its Ohio One site in New Albany, and CNBC reported that the next stage of construction "has finally begun". Intel delayed Ohio One Mod 1 completion to 2030 in February 2025 and slowed the site again that July, so this is physical progress on the part of the build that had stopped moving.

Intel said construction and production-tool installation at Fab 62 in Arizona were fully underway. Intel expected the facility to begin operations by the end of 2028.

Intel CEO Lip-Bu Tan said Intel would continue its involvement in Terafab. Bloomberg reported the statement before an Intel event in Tokyo.

SemiAnalysis reported that its measurements found similar logic density between Panther Lake’s Intel 18A compute logic and TSMC N3E GPU logic. Notebookcheck reported the same SemiAnalysis finding.

Tom’s Hardware reported that Intel Foundry chief Naga Chandrasekaran told KeyBanc that Intel 14A was expected to deliver performance within 5% of TSMC A14. The report did not specify whether Intel 14A was expected to be faster or slower than TSMC A14.

Tech Wire Asia reported that Intel’s new advanced-packaging facility in Penang was scheduled to begin operations in 2026. The report cited Lee Wei Chern, Intel Foundry vice president and Intel Malaysia managing director, as saying the facility would expand Malaysian capabilities in advanced packaging, assembly, test, research and design.

SK hynix said no decisions had been made regarding the two scenarios reported in the article. The statement addressed reported possible arrangements involving Intel and U.S. memory-chip production.

Reuters reported exploratory discussions between SK hynix and Intel about possible U.S. memory-chip manufacturing using Intel's Ohio site. One potential scenario described by Reuters' sources was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.

Reuters reported that SK hynix was holding exploratory discussions with Intel about manufacturing memory chips in the United States. One potential scenario was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.

Intel Foundry and ASML reported that High-NA EUV had processed more than one million wafers cumulatively. Intel said the total included tool certification, research and development, and production on select Panther Lake layers. Intel said overlay, throughput, and availability met its expectations.

Intel priced an underwritten public offering of 210,526,315 shares at US$95 each, raising US$20 billion after upsizing the deal from the US$15 billion announced two days earlier. The price is more than four times the US$20.47 the U.S. government paid per share in August 2025.

Intel Foundry announced completion of the Rapid Assured Microelectronics Prototypes - Commercial program. The announcement identified the program as RAMP-C.

Second-quarter 2026 results showed Intel Foundry segment revenue of US$5.8 billion, up 31 percent from a year earlier, against total company revenue of US$16.1 billion. Segment revenue includes wafers made for Intel's own product groups, so the figure measures foundry activity rather than external customer sales.

Intel and Fortinet announced a strategic collaboration to develop Fortinet Security Processor 6. The announcement identified the product as SP6.

Intel said it was establishing advanced packaging as a focused Intel Foundry business. The business would have dedicated leadership.

Intel Foundry said Intel 18A-P entered risk production. Intel described 18A-P as the first performance enhancement in the Intel 18A family.

Intel committed during the second quarter of 2026 to complete development of Intel 14A. Intel said future products were designed to use the node and manufacturing-expansion projects were underway.

Elon Musk said Terafab planned to use Intel's 14A process. Tom’s Hardware reported that the plan was for use when Terafab had production capacity and the process had matured.

Intel completed the repurchase of Apollo's interest in the Fab 34 joint venture. Intel owned 100% of the joint venture after the repurchase.

Intel announced it had joined the Terafab project alongside SpaceX, xAI and Tesla. An Intel filing later described Intel as a strategic Terafab partner.

Intel and Apollo agreed that Intel would repurchase the 49% interest in the Fab 34 joint venture that Intel did not own. The agreed purchase price was US$14.2 billion.

Intel unveiled Core Ultra Series 3 processors at CES. Intel described the processors as its first AI PC platform built on Intel 18A and designed and manufactured in the United States.

Intel detailed the Core Ultra series 3 processor, code-named Panther Lake, the first product on Intel 18A, and said it would ramp high-volume production at Fab 52 in Chandler, Arizona, with the first SKU shipping before the end of 2025 and broad availability from January 2026.

Nvidia agreed to buy $5 billion of Intel common stock at $23.28 a share and to co-develop custom x86 CPUs linked to Nvidia GPUs over NVLink for data centers and PCs, a month after the US government took its own 10 percent stake in Intel. The same day CNBC reported the Enfabrica acquihire.

Nvidia agreed to buy US$5 billion of Intel stock at US$23.28 a share. Intel will build Nvidia-custom x86 CPUs for Nvidia's data center platforms and x86 system-on-chips with Nvidia RTX GPU chiplets for PCs, connected with NVLink.

Intel agreed to sell the U.S. government 433.3 million new shares at US$20.47 each, a 9.9 percent stake, paid for with US$5.7 billion of CHIPS Act grants that had been awarded but not disbursed and US$3.2 billion from the Secure Enclave program. The stake is passive, with no board seat.

In its second-quarter report new CEO Lip-Bu Tan said Intel had mostly completed a 15 percent workforce cut and would end 2025 with about 75,000 core employees, down from 108,900 across the group at the end of 2024, as it cancelled fabs in Germany and Poland and slowed Ohio. It was the largest cut by share of staff among big tech companies in 2025 and followed 15,000 cuts announced in August 2024.

With second-quarter 2025 results Intel said it would no longer proceed with the planned fabs in Germany and Poland and would slow construction in Ohio to match demand. Its quarterly filing added that without a significant external customer for 14A it might pause or discontinue that node and successor nodes.

Fab 52 in Arizona processed its first wafer through the facility. Intel said the wafer was an Intel 18A wafer.

Intel Foundry said it had engaged lead customers on its Intel 14A process technology. Intel described 14A as the successor to Intel 18A.

Intel's board appointed Lip-Bu Tan, former CEO of Cadence Design Systems, as chief executive effective March 18, 2025, succeeding the interim co-CEOs.

Intel said it planned to complete Ohio One Mod 1 construction in 2030. It said operations would begin between 2030 and 2031.

Intel Foundry added Trusted Semiconductor Solutions and Reliable MicroSystems to the third phase of RAMP-C. The customers were added under the Trusted & Assured Microelectronics Program.

Intel said Gelsinger had retired and left the board effective December 1, 2024, and named CFO David Zinsner and product chief Michelle Johnston Holthaus as interim co-chief executives while the board searched for a successor.

Intel and the Commerce Department finalised the CHIPS Act award at up to US$7.86 billion in direct funding for the Arizona, New Mexico, Ohio and Oregon projects, reduced from the March preliminary figure.

After a loss-making quarter and job cuts, Gelsinger said Intel would set up Intel Foundry as an independent subsidiary inside Intel, expand its collaboration with Amazon Web Services including an AI fabric chip on 18A, and pause its planned fabs in Germany and Poland by about two years.

Intel said the first 18A products, the Panther Lake client chip and Clearwater Forest server chip, had powered on and were healthy, that 18A remained on track for production in 2025, and that the 18A Process Design Kit 1.0 had been released in July so outside customers could start designs.

Intel and the Biden administration announced preliminary terms for up to US$8.5 billion in direct CHIPS Act funding for projects in Arizona, New Mexico, Ohio and Oregon, eligibility for federal loans of up to US$11 billion, and an investment tax credit on more than US$100 billion of qualified investment.

At its first Foundry Direct Connect event Intel relaunched the business as Intel Foundry, combining technology development, manufacturing and foundry services, unveiled the 14A node beyond 18A, and had Microsoft CEO Satya Nadella say Microsoft had chosen a design to be built on Intel 18A.

On the second-quarter 2023 call, as AMD prepared to ramp the MI300, Su said the company would be fully compliant with US export controls but saw an opportunity to develop an accelerator specifically for Chinese customers, following Nvidia's A800 and H800 and Intel's Gaudi variant. That product became the MI308.

Intel said a new manufacturing group segment would be included in reportable P&Ls beginning in the first quarter of 2024. The segment would include manufacturing, technology development, and Intel Foundry Services.

Intel and the German federal government signed a revised letter of intent for two fabs in Magdeburg. Intel said the investment was expected to exceed €30 billion and would receive increased government incentives.

Intel held a groundbreaking ceremony for Fab 52 and Fab 62 at its Ocotillo campus in Chandler, Arizona. Intel put the two-fab project cost at $20 billion.

The U.S. Department of Defense awarded Intel an agreement for the first phase of the RAMP-C program. Intel Foundry Services was designated to lead the work.

Intel published a process roadmap renaming its nodes Intel 7, Intel 4, Intel 3, Intel 20A and Intel 18A, introducing RibbonFET gate-all-around transistors and PowerVia backside power at 20A, and targeting 18A for 2025, the plan later summarised as five nodes in four years.

In his first strategy event as CEO, Pat Gelsinger said Intel would keep manufacturing in house, expand capacity starting with roughly US$20 billion for two new fabs in Arizona, use outside foundries for some products, and create Intel Foundry Services as a standalone unit to make chips for others.

Nvidia's first big acquisition, at $125 a share in cash, brought in the Israeli maker of InfiniBand and Ethernet interconnects that already sat inside most of the world's top supercomputers, after reports that Intel and Xilinx had also bid. Jensen Huang framed it as uniting compute and networking for data-center-scale computing; the deal needed approvals in the US, EU, Mexico and China.