{
  "data_version": "1",
  "schema": "https://whatledto.com/data",
  "id": "intel",
  "name": "Intel",
  "kind": "company",
  "url": "https://whatledto.com/who/intel",
  "description": "Chipmaker rebuilding itself around its foundry business and the 18A process.",
  "same_as": [
    "https://en.wikipedia.org/wiki/Intel",
    "https://www.intel.com/"
  ],
  "timelines": [
    {
      "slug": "intel-foundry-18a",
      "title": "Intel Foundry and 18A: From IDM 2.0 to a Government-Owned Stake",
      "url": "https://whatledto.com/events/intel-foundry-18a",
      "json": "https://whatledto.com/events/intel-foundry-18a.json",
      "role": "Chipmaker pursuing a transition from an integrated manufacturer to a contract foundry while continuing to make its own products.",
      "entries": 42,
      "updated_at": "2026-10-22T03:14:17.271017+00:00"
    },
    {
      "slug": "us-layoffs-register-2025-2026",
      "title": "Who Cut Jobs When: A Register of Major U.S. Layoffs, 2025 to 2026",
      "url": "https://whatledto.com/events/us-layoffs-register-2025-2026",
      "json": "https://whatledto.com/events/us-layoffs-register-2025-2026.json",
      "role": "Said it had mostly completed a 15% workforce reduction in 2025.",
      "entries": 1,
      "updated_at": "2026-10-22T03:11:00.402205+00:00"
    },
    {
      "slug": "hbm-memory-supply",
      "title": "HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E",
      "url": "https://whatledto.com/events/hbm-memory-supply",
      "json": "https://whatledto.com/events/hbm-memory-supply.json",
      "role": "Held exploratory discussions with SK hynix about possible U.S. memory manufacturing, though SK hynix said no arrangement was finalized.",
      "entries": 1,
      "updated_at": "2026-10-14T05:44:42.508947+00:00"
    },
    {
      "slug": "nvidia-acquisitions",
      "title": "Nvidia's Dealmaking: From Mellanox and the Failed Arm Bid to Groq and Hugging Face",
      "url": "https://whatledto.com/events/nvidia-acquisitions",
      "json": "https://whatledto.com/events/nvidia-acquisitions.json",
      "role": "Chipmaker in which Nvidia agreed to buy a $5 billion common-stock stake alongside a joint product-development agreement.",
      "entries": 2,
      "updated_at": "2026-10-14T04:57:05.710223+00:00"
    },
    {
      "slug": "amd-china-export-controls",
      "title": "US Export Controls on AMD's AI Chips in China: From the MI250 License to MI308 and MI325X",
      "url": "https://whatledto.com/events/amd-china-export-controls",
      "json": "https://whatledto.com/events/amd-china-export-controls.json",
      "role": "Its Gaudi variant was cited by Lisa Su as a model for a compliant AI accelerator for Chinese customers.",
      "entries": 1,
      "updated_at": "2026-10-14T02:01:40.262749+00:00"
    }
  ],
  "entries": [
    {
      "timeline": "intel-foundry-18a",
      "id": 2219,
      "url": "https://whatledto.com/events/intel-foundry-18a#n2219",
      "date": "2026-10-21",
      "date_precision": "day",
      "title": "Ohio One gets its first major truss, on a site Intel had pushed to 2030",
      "summary": "Intel said the first major structural truss had been installed on the first fab at its Ohio One site in New Albany, and CNBC reported that the next stage of construction \"has finally begun\". Intel delayed Ohio One Mod 1 completion to 2030 in February 2025 and slowed the site again that July, so this is physical progress on the part of the build that had stopped moving.",
      "type": "other",
      "entities": [
        "Intel",
        "Ohio One"
      ],
      "parties": [
        "intel",
        "ohio-one"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/opinion/building-america-capacity-to-innovate.html",
          "outlet": "Intel",
          "published": "2026-10-21",
          "quote": "We’re also making progress in Ohio, where the first major structural truss has been installed on the first fab in New Albany."
        },
        {
          "url": "https://www.cnbc.com/2026/10/21/intel-hits-construction-milestone-at-delayed-ohio-chip-fab-.html",
          "outlet": "CNBC",
          "published": "2026-10-21",
          "quote": "On Wednesday, Intel announced that crews have installed the first major structural truss in Ohio, which means the next part of the construction has finally begun."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 2218,
      "url": "https://whatledto.com/events/intel-foundry-18a#n2218",
      "date": "2026-10-21",
      "date_precision": "day",
      "title": "Intel says Fab 62 construction and tool installation are underway",
      "summary": "Intel said construction and production-tool installation at Fab 62 in Arizona were fully underway. Intel expected the facility to begin operations by the end of 2028.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Fab 62"
      ],
      "parties": [
        "intel",
        "fab-62"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/opinion/building-america-capacity-to-innovate.html",
          "outlet": "Intel",
          "published": "2026-10-21",
          "quote": "Today, I am pleased to share that construction and tool installation at Fab 62 are now fully underway, and we expect operations to begin by the end of 2028."
        },
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/intel-installs-production-tools-at-fab-62-in-arizona-provides-updates-on-ohio-chip-fab-confirms-high-na-euv-for-high-volume-manufacturing-in-2028",
          "outlet": "Tom’s Hardware",
          "published": "2026-10-21",
          "quote": "Intel on Wednesday announced that it had started installing production tools at its Fab 62 in Arizona, and the fab is on track for mass production by late 2028."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1916,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1916",
      "date": "2026-10-07",
      "date_precision": "day",
      "title": "Tan says Intel will continue Terafab involvement",
      "summary": "Intel CEO Lip-Bu Tan said Intel would continue its involvement in Terafab. Bloomberg reported the statement before an Intel event in Tokyo.",
      "type": "response",
      "entities": [
        "Intel",
        "Terafab",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "terafab",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://www.moneycontrol.com/news/business/intel-stays-with-elon-musk-s-terafab-project-even-as-tsmc-talks-raise-investor-concerns-14046615.html",
          "outlet": "Bloomberg via Moneycontrol",
          "published": "2026-10-07",
          "quote": "Intel will continue its involvement in Terafab, Tan told Bloomberg prior to an event in Tokyo commemorating the US company’s 50th year of operations in Japan."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1755,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1755",
      "date": "2026-09-26",
      "date_precision": "day",
      "title": "SemiAnalysis finds similar density for Panther Lake 18A and TSMC N3E logic",
      "summary": "SemiAnalysis reported that its measurements found similar logic density between Panther Lake’s Intel 18A compute logic and TSMC N3E GPU logic. Notebookcheck reported the same SemiAnalysis finding.",
      "type": "report",
      "entities": [
        "Intel",
        "Intel 18A",
        "Panther Lake / Core Ultra Series 3",
        "SemiAnalysis",
        "TSMC",
        "TSMC N3E"
      ],
      "parties": [
        "intel",
        "intel-18a",
        "panther-lake-core-ultra-series-3",
        "semianalysis",
        "tsmc",
        "tsmc-n3e"
      ],
      "sources": [
        {
          "url": "https://newsletter.semianalysis.com/p/intel-panther-lake-teardown",
          "outlet": "SemiAnalysis",
          "published": "2026-09-26",
          "quote": "Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density."
        },
        {
          "url": "https://www.notebookcheck.net/Panther-Lake-teardown-reveals-Intel-18A-in-detail-TSMC-still-leads-in-density.1410032.0.html",
          "outlet": "Notebookcheck",
          "published": "2026-09-27",
          "quote": "SemiAnalysis measured Panther Lake’s 18A compute logic and found that it has roughly the same density as the GPU logic manufactured on TSMC’s N3E process."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1754,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1754",
      "date": "2026-09-25",
      "date_precision": "day",
      "title": "Intel Foundry chief expects Intel 14A within 5% of TSMC A14 performance",
      "summary": "Tom’s Hardware reported that Intel Foundry chief Naga Chandrasekaran told KeyBanc that Intel 14A was expected to deliver performance within 5% of TSMC A14. The report did not specify whether Intel 14A was expected to be faster or slower than TSMC A14.",
      "type": "report",
      "entities": [
        "Intel",
        "Intel 14A",
        "TSMC A14",
        "Naga Chandrasekaran",
        "KeyBanc"
      ],
      "parties": [
        "intel",
        "intel-14a",
        "tsmc-a14",
        "naga-chandrasekaran",
        "keybanc"
      ],
      "sources": [
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/intel-expects-14a-to-be-within-5-percent-the-performance-of-tsmcs-a14-conservative-forecast-clashes-with-18as-frequency-lead-and-promised-20-percent-gains",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-25",
          "quote": "Intel's 14A (1.4nm-class) process technology is expected to deliver performance 'within 5%' of TSMC's A14 (1.4nm-class) production node, Naga Chandrasekaran, the chief technology and operations officer as well as general manager of Intel Foundry, told investment banking firm KeyBanc (via @Alex_Intel)."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1487,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1487",
      "date": "2026-09-24",
      "date_precision": "day",
      "title": "Intel Penang packaging facility scheduled to begin operations in 2026",
      "summary": "Tech Wire Asia reported that Intel’s new advanced-packaging facility in Penang was scheduled to begin operations in 2026. The report cited Lee Wei Chern, Intel Foundry vice president and Intel Malaysia managing director, as saying the facility would expand Malaysian capabilities in advanced packaging, assembly, test, research and design.",
      "type": "report",
      "entities": [
        "Intel",
        "Intel Malaysia",
        "Lee Wei Chern"
      ],
      "parties": [
        "intel",
        "intel-malaysia",
        "lee-wei-chern"
      ],
      "sources": [
        {
          "url": "https://techwireasia.com/2026/09/intel-malaysia-advanced-packaging-ai-chips/",
          "outlet": "Tech Wire Asia",
          "published": "2026-09-24",
          "quote": "“Intel’s new advanced packaging facility in Penang, scheduled to begin operations this year, will expand the company’s manufacturing capabilities in Malaysia.”"
        },
        {
          "url": "https://download.intel.com/newsroom/archive/2025/en-us-2024-09-16-pat-gelsinger-on-foundry-momentum-progress-on-plan.pdf",
          "outlet": "Intel Newsroom",
          "published": "2024-09-16",
          "quote": "“We plan to complete the construction of our new advanced packaging factory in Malaysia but will align the startup with market conditions and increased utilization of our existing capacity.”"
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1361,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1361",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "SK hynix says no decision has been made on reported Intel scenarios",
      "summary": "SK hynix said no decisions had been made regarding the two scenarios reported in the article. The statement addressed reported possible arrangements involving Intel and U.S. memory-chip production.",
      "type": "response",
      "entities": [
        "SK hynix",
        "Intel",
        "Intel Ohio One"
      ],
      "parties": [
        "sk-hynix",
        "intel",
        "intel-ohio-one"
      ],
      "sources": [
        {
          "url": "https://news.skhynix.com/en/fact-10/",
          "outlet": "SK hynix Newsroom",
          "published": "2026-09-16",
          "quote": "No decisions have been made regarding the two scenarios mentioned in the article."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1360,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1360",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "Reuters reports possible SK hynix use of Intel's Ohio facility",
      "summary": "Reuters reported exploratory discussions between SK hynix and Intel about possible U.S. memory-chip manufacturing using Intel's Ohio site. One potential scenario described by Reuters' sources was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.",
      "type": "report",
      "entities": [
        "SK hynix",
        "Intel",
        "Intel Ohio One"
      ],
      "parties": [
        "sk-hynix",
        "intel",
        "intel-ohio-one"
      ],
      "sources": [
        {
          "url": "https://ca.marketscreener.com/news/sk-hynix-in-talks-with-intel-about-deal-to-make-memory-chips-in-the-us-for-the-first-time-sources-s-ce785bd2d881f52c",
          "outlet": "Reuters, via MarketScreener",
          "published": "2026-09-16",
          "quote": "Under one potential scenario, SK Hynix would lease part of Intel's long-planned chipmaking facility in Ohio, they said."
        }
      ]
    },
    {
      "timeline": "hbm-memory-supply",
      "id": 1357,
      "url": "https://whatledto.com/events/hbm-memory-supply#n1357",
      "date": "2026-09-16",
      "date_precision": "day",
      "title": "Reuters reports SK hynix and Intel held U.S. memory manufacturing talks",
      "summary": "Reuters reported that SK hynix was holding exploratory discussions with Intel about manufacturing memory chips in the United States. One potential scenario was for SK hynix to lease part of Intel's planned Ohio chipmaking facility.",
      "type": "report",
      "entities": [
        "SK hynix",
        "Intel"
      ],
      "parties": [
        "sk-hynix",
        "intel"
      ],
      "sources": [
        {
          "url": "https://m.investing.com/news/stock-market-news/exclusivesk-hynix-in-talks-with-intel-about-deal-to-make-memory-chips-in-the-us-for-the-first-time-sources-say-4902886?ampMode=1",
          "outlet": "Reuters (via Investing.com)",
          "published": "2026-09-16",
          "quote": "“Under one potential scenario, SK Hynix would lease part of Intel’s long-planned chipmaking facility in Ohio, they said.”"
        },
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-reportedly-discussing-us-memory-chip-manufacturing-with-intel-options-include-leasing-ohio-plant-or-forming-joint-venture-with-other-ai-hyperscalers",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-16",
          "quote": "“South Korean memory chip manufacturer SK hynix is in talks with Intel to start manufacturing inside the U.S., according to Reuters.”"
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 666,
      "url": "https://whatledto.com/events/intel-foundry-18a#n666",
      "date": "2026-09-07",
      "date_precision": "day",
      "title": "Intel Foundry and ASML report one million High-NA EUV wafers",
      "summary": "Intel Foundry and ASML reported that High-NA EUV had processed more than one million wafers cumulatively. Intel said the total included tool certification, research and development, and production on select Panther Lake layers. Intel said overlay, throughput, and availability met its expectations.",
      "type": "report",
      "entities": [
        "Intel",
        "ASML",
        "Panther Lake / Core Ultra Series 3",
        "High-NA EUV",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "asml",
        "panther-lake-core-ultra-series-3",
        "high-na-euv",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-foundry/intel-foundry-asml-accelerate-industry-readiness-for-high-na-euv.html",
          "outlet": "Intel Newsroom",
          "published": "2026-09-07",
          "quote": "Overlay, throughput and availability are meeting Intel Foundry's expectations."
        },
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/intel-surpasses-one-million-high-na-euv-wafers-processed-outpaces-the-rest-of-the-industry-combined-company-also-trailblazing-giant-6-12-photomasks-to-speed-production-and-lower-costs1",
          "outlet": "Tom’s Hardware",
          "published": "2026-09-08",
          "quote": "Intel's one million wafers figure includes wafers processed during tool installation and certification, R&D, and production."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 99,
      "url": "https://whatledto.com/events/intel-foundry-18a#n99",
      "date": "2026-08-12",
      "date_precision": "day",
      "title": "Intel raises US$20 billion in a stock offering priced at US$95 a share",
      "summary": "Intel priced an underwritten public offering of 210,526,315 shares at US$95 each, raising US$20 billion after upsizing the deal from the US$15 billion announced two days earlier. The price is more than four times the US$20.47 the U.S. government paid per share in August 2025.",
      "type": "financial",
      "entities": [
        "Intel",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-announces-upsize-and-pricing-of-20-billion-common-stock-offering",
          "outlet": "Intel Newsroom",
          "published": "2026-08-12",
          "quote": "Intel priced the underwritten public offering of 210,526,315 shares of common stock at a public offering price of $95 per share."
        },
        {
          "url": "https://newsroom.intel.com/corporate/intel-announces-proposed-15-billion-common-stock-offering",
          "outlet": "Intel Newsroom",
          "published": "2026-08-10",
          "quote": "Intel Corporation (Nasdaq: INTC) today announced a $15 billion underwritten public offering of common stock."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 98,
      "url": "https://whatledto.com/events/intel-foundry-18a#n98",
      "date": "2026-07-28",
      "date_precision": "day",
      "title": "Intel Foundry completes the RAMP-C program",
      "summary": "Intel Foundry announced completion of the Rapid Assured Microelectronics Prototypes - Commercial program. The announcement identified the program as RAMP-C.",
      "type": "other",
      "entities": [
        "Intel",
        "RAMP-C",
        "U.S. Department of War",
        "Secure Enclave",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "ramp-c",
        "us-department-of-war",
        "secure-enclave",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-foundry/intel-completes-ramp-c-program-accelerating-momentum-for-secure-enclave.html",
          "outlet": "Intel Newsroom",
          "published": "2026-07-28",
          "quote": "Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 100,
      "url": "https://whatledto.com/events/intel-foundry-18a#n100",
      "date": "2026-07-23",
      "date_precision": "day",
      "title": "Intel Foundry segment revenue reaches US$5.8 billion, up 31 percent",
      "summary": "Second-quarter 2026 results showed Intel Foundry segment revenue of US$5.8 billion, up 31 percent from a year earlier, against total company revenue of US$16.1 billion. Segment revenue includes wafers made for Intel's own product groups, so the figure measures foundry activity rather than external customer sales.",
      "type": "financial",
      "entities": [
        "Intel",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://www.sec.gov/Archives/edgar/data/50863/000005086326000155/q226earningsrelease.htm",
          "outlet": "Intel Q2 2026 results (SEC exhibit)",
          "published": "2026-07-23",
          "quote": "Intel Foundry 5.8 billion up 31%"
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 97,
      "url": "https://whatledto.com/events/intel-foundry-18a#n97",
      "date": "2026-07-21",
      "date_precision": "day",
      "title": "Intel and Fortinet collaborate on Security Processor 6",
      "summary": "Intel and Fortinet announced a strategic collaboration to develop Fortinet Security Processor 6. The announcement identified the product as SP6.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Fortinet",
        "Fortinet Security Processor 6"
      ],
      "parties": [
        "intel",
        "fortinet",
        "fortinet-security-processor-6"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/manufacturing/intel-and-fortinet-collaborate-to-advance-cybersecurity-innovation-and-strengthen-global-supply-chain-resilience",
          "outlet": "Intel Newsroom",
          "published": "2026-07-21",
          "quote": "Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6)."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 96,
      "url": "https://whatledto.com/events/intel-foundry-18a#n96",
      "date": "2026-06-18",
      "date_precision": "day",
      "title": "Intel Foundry establishes advanced packaging as a focused business",
      "summary": "Intel said it was establishing advanced packaging as a focused Intel Foundry business. The business would have dedicated leadership.",
      "type": "announcement",
      "entities": [
        "Intel"
      ],
      "parties": [
        "intel"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/intel-announces-leadership-appointment-at-intel-foundry-to-accelerate-development-and-manufacturing.html",
          "outlet": "Intel Newsroom",
          "published": "2026-06-18",
          "quote": "As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 95,
      "url": "https://whatledto.com/events/intel-foundry-18a#n95",
      "date": "2026-06-16",
      "date_precision": "day",
      "title": "Intel 18A-P enters risk production",
      "summary": "Intel Foundry said Intel 18A-P entered risk production. Intel described 18A-P as the first performance enhancement in the Intel 18A family.",
      "type": "other",
      "entities": [
        "Intel",
        "Intel 18A-P",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "intel-18a-p",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/intel-foundry-details-process-milestones-future-innovation-at-vlsi-symposium.html",
          "outlet": "Intel Newsroom",
          "published": "2026-06-16",
          "quote": "It shared that Intel 18A-P, the first performance enhancement in the Intel 18A family, has entered risk production, meeting the timeline first shared with customers and partners last year."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 94,
      "url": "https://whatledto.com/events/intel-foundry-18a#n94",
      "date": "2026-06",
      "date_precision": "month",
      "title": "Intel commits to complete Intel 14A development",
      "summary": "Intel committed during the second quarter of 2026 to complete development of Intel 14A. Intel said future products were designed to use the node and manufacturing-expansion projects were underway.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Intel 14A"
      ],
      "parties": [
        "intel",
        "intel-14a"
      ],
      "sources": [
        {
          "url": "https://www.intc.com/filings-reports/all-sec-filings/content/0000050863-26-000157/intc-20260627.htm",
          "outlet": "Intel Form 10-Q for quarter ended 2026-06-27",
          "published": "2026-07",
          "quote": "During Q2 2026, we committed to completing development of Intel 14A, with a number of future Intel products designed to utilize the node and manufacturing expansion projects underway for production of products on the node."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1914,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1914",
      "date": "2026-04-22",
      "date_precision": "day",
      "title": "Musk says Terafab plans to use Intel 14A",
      "summary": "Elon Musk said Terafab planned to use Intel's 14A process. Tom’s Hardware reported that the plan was for use when Terafab had production capacity and the process had matured.",
      "type": "announcement",
      "entities": [
        "Tesla",
        "Elon Musk",
        "Terafab",
        "Intel",
        "Intel 14A"
      ],
      "parties": [
        "tesla",
        "elon-musk",
        "terafab",
        "intel",
        "intel-14a"
      ],
      "sources": [
        {
          "url": "https://stockanalysis.com/stocks/tsla/transcripts/547944-q1-2026/",
          "outlet": "Stock Analysis, Tesla Q1 2026 earnings-call transcript",
          "published": "2026-04-22",
          "quote": "We plan to use Intel's 14A process, which is state-of-the-art and in fact, not yet totally complete."
        },
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/elon-musk-says-terafab-will-use-intels-14a-process-technology-to-make-ai-chips-spacex-will-be-responsible-for-high-volume-chip-manufacturing-in-liekly-intel-tech-licensing-deal",
          "outlet": "Tom’s Hardware",
          "published": "2026-04-23",
          "quote": "Elon Musk on Wednesday said that TeraFab plans to use Intel's 14A fabrication technology when it has its own production capacity later this decade and when the manufacturing process matures."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 93,
      "url": "https://whatledto.com/events/intel-foundry-18a#n93",
      "date": "2026-04-08",
      "date_precision": "day",
      "title": "Intel becomes sole owner of the Fab 34 joint venture",
      "summary": "Intel completed the repurchase of Apollo's interest in the Fab 34 joint venture. Intel owned 100% of the joint venture after the repurchase.",
      "type": "financial",
      "entities": [
        "Intel",
        "Apollo",
        "Fab 34",
        "Ireland"
      ],
      "parties": [
        "intel",
        "apollo",
        "fab-34",
        "ireland"
      ],
      "sources": [
        {
          "url": "https://www.intc.com/filings-reports/all-sec-filings/content/0000050863-26-000072/intc-20260408.htm",
          "outlet": "Intel Form 8-K",
          "published": "2026-04-08",
          "quote": "Intel owns 100% of the joint venture following the repurchase."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 1913,
      "url": "https://whatledto.com/events/intel-foundry-18a#n1913",
      "date": "2026-04-07",
      "date_precision": "day",
      "title": "Intel joins the Terafab project",
      "summary": "Intel announced it had joined the Terafab project alongside SpaceX, xAI and Tesla. An Intel filing later described Intel as a strategic Terafab partner.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Terafab",
        "SpaceX",
        "xAI",
        "Tesla"
      ],
      "parties": [
        "intel",
        "terafab",
        "spacex",
        "xai",
        "tesla"
      ],
      "sources": [
        {
          "url": "https://www.tomshardware.com/tech-industry/semiconductors/intel-joins-elon-musks-terafab-project-intel-is-proud-to-join-the-terafab-project-with-spacex-xai-and-tesla-to-help-refactor-silicon-fab-technology?trk=article-ssr-frontend-pulse_little-text-block",
          "outlet": "Tom’s Hardware",
          "published": "2026-04-07",
          "quote": "Intel is proud to join the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology"
        },
        {
          "url": "https://www.intc.com/filings-reports/all-sec-filings/content/0000050863-26-000077/0000050863-26-000077.pdf",
          "outlet": "Intel Corporation Form 8-K",
          "published": "2026-04-23",
          "quote": "Intel joined the Terafab project as a strategic partner alongside SpaceX, xAI, and Tesla."
        },
        {
          "url": "https://download.intel.com/newsroom/2026/earnings/1Q2026-Earnings-Call.pdf",
          "outlet": "Intel",
          "published": "2026-04-23",
          "quote": "We recently announced our partnership with SpaceX, xAI and Tesla to support Terafab."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 92,
      "url": "https://whatledto.com/events/intel-foundry-18a#n92",
      "date": "2026-04-01",
      "date_precision": "day",
      "title": "Intel agrees to repurchase Apollo's Fab 34 venture stake",
      "summary": "Intel and Apollo agreed that Intel would repurchase the 49% interest in the Fab 34 joint venture that Intel did not own. The agreed purchase price was US$14.2 billion.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Apollo",
        "Fab 34",
        "Ireland"
      ],
      "parties": [
        "intel",
        "apollo",
        "fab-34",
        "ireland"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-repurchase-49-equity-interest-ireland-fab-joint-venture",
          "outlet": "Intel Newsroom",
          "published": "2026-04-01",
          "quote": "Intel Corporation (Nasdaq: INTC) and Apollo (NYSE: APO) today announced a definitive agreement for Intel to repurchase the 49% equity interest in the joint venture related to Intel’s Fab 34 in Ireland not held by Intel for $14.2 billion."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 91,
      "url": "https://whatledto.com/events/intel-foundry-18a#n91",
      "date": "2026-01-05",
      "date_precision": "day",
      "title": "Intel unveils Core Ultra Series 3 built on Intel 18A",
      "summary": "Intel unveiled Core Ultra Series 3 processors at CES. Intel described the processors as its first AI PC platform built on Intel 18A and designed and manufactured in the United States.",
      "type": "launch",
      "entities": [
        "Intel",
        "Intel Core Ultra Series 3",
        "Intel 18A",
        "CES"
      ],
      "parties": [
        "intel",
        "intel-core-ultra-series-3",
        "intel-18a",
        "ces"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/artificial-intelligence/ces-2026-intel-core-ultra-series-3-debut-first-built-on-intel-18a.html",
          "outlet": "Intel Newsroom",
          "published": "2026-01-05",
          "quote": "Today at CES, Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 82,
      "url": "https://whatledto.com/events/intel-foundry-18a#n82",
      "date": "2025-10-09",
      "date_precision": "day",
      "title": "Panther Lake unveiled as the first 18A product; high-volume production at Fab 52 in Arizona",
      "summary": "Intel detailed the Core Ultra series 3 processor, code-named Panther Lake, the first product on Intel\n18A, and said it would ramp high-volume production at Fab 52 in Chandler, Arizona, with the first SKU\nshipping before the end of 2025 and broad availability from January 2026.",
      "type": "launch",
      "entities": [
        "Intel",
        "Intel 18A",
        "Fab 52"
      ],
      "parties": [
        "intel",
        "intel-18a",
        "fab-52"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/client-computing/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a",
          "outlet": "Intel Newsroom",
          "published": "2025-10-09",
          "quote": "Panther Lake will begin ramping high-volume production this year, with the first SKU slated to ship before the end of the year and broad market availability starting January 2026."
        }
      ]
    },
    {
      "timeline": "nvidia-acquisitions",
      "id": 687,
      "url": "https://whatledto.com/events/nvidia-acquisitions#n687",
      "date": "2025-09-18",
      "date_precision": "day",
      "title": "$5 billion for a stake in Intel, with joint data center and PC chips",
      "summary": "Nvidia agreed to buy $5 billion of Intel common stock at $23.28 a share and to co-develop custom x86 CPUs linked to Nvidia GPUs over NVLink for data centers and PCs, a month after the US government took its own 10 percent stake in Intel. The same day CNBC reported the Enfabrica acquihire.",
      "type": "announcement",
      "entities": [
        "Nvidia",
        "Intel",
        "Jensen Huang",
        "Lip-Bu Tan"
      ],
      "parties": [
        "nvidia",
        "intel",
        "jensen-huang",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://nvidianews.nvidia.com/news/nvidia-and-intel-to-develop-ai-infrastructure-and-personal-computing-products",
          "outlet": "NVIDIA Newsroom",
          "published": "2025-09-18",
          "quote": "NVIDIA (NASDAQ: NVDA) and Intel Corporation (NASDAQ: INTC) today announced a collaboration to jointly develop multiple generations of custom data center and PC products that accelerate applications and workloads across hyperscale, enterprise and consumer markets."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 81,
      "url": "https://whatledto.com/events/intel-foundry-18a#n81",
      "date": "2025-09-18",
      "date_precision": "day",
      "title": "Nvidia invests US$5 billion in Intel; the two will build custom x86 CPUs and RTX-based PC chips",
      "summary": "Nvidia agreed to buy US$5 billion of Intel stock at US$23.28 a share. Intel will build Nvidia-custom x86\nCPUs for Nvidia's data center platforms and x86 system-on-chips with Nvidia RTX GPU chiplets for PCs,\nconnected with NVLink.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Nvidia",
        "Lip-Bu Tan",
        "Jensen Huang"
      ],
      "parties": [
        "intel",
        "nvidia",
        "lip-bu-tan",
        "jensen-huang"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/artificial-intelligence/intel-and-nvidia-to-jointly-develop-ai-infrastructure-and-personal-computing-products",
          "outlet": "Intel Newsroom",
          "published": "2025-09-18",
          "quote": "For data centers, Intel will build NVIDIA-custom x86 CPUs that NVIDIA will integrate into its AI infrastructure platforms and offer to the market."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 80,
      "url": "https://whatledto.com/events/intel-foundry-18a#n80",
      "date": "2025-08-22",
      "date_precision": "day",
      "title": "US government takes a 9.9 percent stake in Intel for US$8.9 billion, funded from unpaid CHIPS grants",
      "summary": "Intel agreed to sell the U.S. government 433.3 million new shares at US$20.47 each, a 9.9 percent stake,\npaid for with US$5.7 billion of CHIPS Act grants that had been awarded but not disbursed and US$3.2\nbillion from the Secure Enclave program. The stake is passive, with no board seat.",
      "type": "financial",
      "entities": [
        "Intel",
        "U.S. Department of Commerce",
        "Donald Trump",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "us-department-of-commerce",
        "donald-trump",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-and-trump-administration-reach-historic-agreement",
          "outlet": "Intel Newsroom",
          "published": "2025-08-22",
          "quote": "Under the terms of today’s announcement, the government agrees to purchase 433.3 million primary shares of Intel common stock at a price of $20.47 per share, equivalent to a 9.9 percent stake in the company."
        }
      ]
    },
    {
      "timeline": "us-layoffs-register-2025-2026",
      "id": 454,
      "url": "https://whatledto.com/events/us-layoffs-register-2025-2026#n454",
      "date": "2025-07-24",
      "date_precision": "day",
      "title": "Intel: 15% of the workforce gone, headcount to 75,000 by year-end",
      "summary": "In its second-quarter report new CEO Lip-Bu Tan said Intel had mostly completed a 15 percent workforce cut and would end 2025 with about 75,000 core employees, down from 108,900 across the group at the end of 2024, as it cancelled fabs in Germany and Poland and slowed Ohio. It was the largest cut by share of staff among big tech companies in 2025 and followed 15,000 cuts announced in August 2024.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://www.cnn.com/2025/07/24/tech/intel-layoffs-15-percent-q2-earnings",
          "outlet": "CNN Business",
          "published": "2025-07-24",
          "quote": "The company said it plans to end 2025 with 75,000 employees in its core Intel division — not including subsidiaries — as a result of “workforce reductions and attrition"
        },
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/lip-bu-tan-steps-in-the-right-direction.html",
          "outlet": "Intel Newsroom",
          "published": "2025-07-24",
          "quote": "We are implementing a plan to reduce our headcount by approximately 15%, and we plan to end the year with a global workforce of about 75,000 employees as a result of workforce reductions and attrition."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 79,
      "url": "https://whatledto.com/events/intel-foundry-18a#n79",
      "date": "2025-07-24",
      "date_precision": "day",
      "title": "Intel cancels Germany and Poland fabs, slows Ohio, and makes 14A conditional on an outside customer",
      "summary": "With second-quarter 2025 results Intel said it would no longer proceed with the planned fabs in Germany\nand Poland and would slow construction in Ohio to match demand. Its quarterly filing added that without\na significant external customer for 14A it might pause or discontinue that node and successor nodes.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Lip-Bu Tan",
        "Intel 14A"
      ],
      "parties": [
        "intel",
        "lip-bu-tan",
        "intel-14a"
      ],
      "sources": [
        {
          "url": "https://www.sec.gov/Archives/edgar/data/50863/000005086325000107/q225_earningsrelease.htm",
          "outlet": "Intel Q2 2025 results (SEC exhibit)",
          "published": "2025-07-24",
          "quote": "As part of this effort, Intel will no longer move forward with planned projects in Germany and Poland."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 90,
      "url": "https://whatledto.com/events/intel-foundry-18a#n90",
      "date": "2025-04-29",
      "date_precision": "day",
      "title": "Fab 52 processes its first Intel 18A wafer",
      "summary": "Fab 52 in Arizona processed its first wafer through the facility. Intel said the wafer was an Intel 18A wafer.",
      "type": "other",
      "entities": [
        "Intel",
        "Fab 52",
        "Intel 18A",
        "Arizona"
      ],
      "parties": [
        "intel",
        "fab-52",
        "intel-18a",
        "arizona"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/intel-foundry-gathers-customers-partners-outlines-priorities.html",
          "outlet": "Intel Newsroom",
          "published": "2025-04-29",
          "quote": "Fab 52 in Arizona has successfully “run the lot,” marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 89,
      "url": "https://whatledto.com/events/intel-foundry-18a#n89",
      "date": "2025-04-29",
      "date_precision": "day",
      "title": "Intel Foundry engages lead customers on Intel 14A",
      "summary": "Intel Foundry said it had engaged lead customers on its Intel 14A process technology. Intel described 14A as the successor to Intel 18A.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Intel 14A",
        "Intel 18A",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "intel-14a",
        "intel-18a",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/intel-foundry-gathers-customers-partners-outlines-priorities.html",
          "outlet": "Intel Newsroom",
          "published": "2025-04-29",
          "quote": "Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 78,
      "url": "https://whatledto.com/events/intel-foundry-18a#n78",
      "date": "2025-03-12",
      "date_precision": "day",
      "title": "Lip-Bu Tan appointed Intel CEO",
      "summary": "Intel's board appointed Lip-Bu Tan, former CEO of Cadence Design Systems, as chief executive effective\nMarch 18, 2025, succeeding the interim co-CEOs.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Lip-Bu Tan"
      ],
      "parties": [
        "intel",
        "lip-bu-tan"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-appoints-lip-bu-tan-chief-executive-officer",
          "outlet": "Intel Newsroom",
          "published": "2025-03-12",
          "quote": "Intel Corporation (Nasdaq: INTC) today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 88,
      "url": "https://whatledto.com/events/intel-foundry-18a#n88",
      "date": "2025-02-28",
      "date_precision": "day",
      "title": "Intel delays Ohio One Mod 1 completion to 2030",
      "summary": "Intel said it planned to complete Ohio One Mod 1 construction in 2030. It said operations would begin between 2030 and 2031.",
      "type": "delay",
      "entities": [
        "Intel",
        "Intel Foundry Manufacturing",
        "Ohio One",
        "New Albany",
        "Ohio",
        "Naga Chandrasekaran"
      ],
      "parties": [
        "intel",
        "intel-foundry-manufacturing",
        "ohio-one",
        "new-albany",
        "ohio",
        "naga-chandrasekaran"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/corporate/ohio-one-construction-timeline-update.html",
          "outlet": "Intel Newsroom",
          "published": "2025-02-28",
          "quote": "Specifically, we now plan to complete construction of Mod 1 in 2030 and begin operations between 2030 and 2031."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 87,
      "url": "https://whatledto.com/events/intel-foundry-18a#n87",
      "date": "2025-01-17",
      "date_precision": "day",
      "title": "Intel Foundry adds two customers to RAMP-C phase three",
      "summary": "Intel Foundry added Trusted Semiconductor Solutions and Reliable MicroSystems to the third phase of RAMP-C. The customers were added under the Trusted & Assured Microelectronics Program.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Trusted Semiconductor Solutions",
        "Reliable MicroSystems",
        "RAMP-C",
        "U.S. Department of Defense",
        "OUSD(R&E)"
      ],
      "parties": [
        "intel",
        "trusted-semiconductor-solutions",
        "reliable-microsystems",
        "ramp-c",
        "us-department-of-defense",
        "ousdr-e"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/intel-foundry/intel-foundry-adds-customers-ramp-c-project-us-defense",
          "outlet": "Intel Newsroom",
          "published": "2025-01-17",
          "quote": "Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E))."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 77,
      "url": "https://whatledto.com/events/intel-foundry-18a#n77",
      "date": "2024-12-02",
      "date_precision": "day",
      "title": "Pat Gelsinger retires; two interim co-CEOs take over",
      "summary": "Intel said Gelsinger had retired and left the board effective December 1, 2024, and named CFO David\nZinsner and product chief Michelle Johnston Holthaus as interim co-chief executives while the board\nsearched for a successor.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Pat Gelsinger",
        "David Zinsner",
        "Michelle Johnston Holthaus"
      ],
      "parties": [
        "intel",
        "pat-gelsinger",
        "david-zinsner",
        "michelle-johnston-holthaus"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-ceo-news-dec-2024",
          "outlet": "Intel Newsroom",
          "published": "2024-12-02",
          "quote": "Intel has named two senior leaders, David Zinsner and Michelle (MJ) Johnston Holthaus, as interim co-chief executive officers while the board of directors conducts a search for a new CEO."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 76,
      "url": "https://whatledto.com/events/intel-foundry-18a#n76",
      "date": "2024-11-26",
      "date_precision": "day",
      "title": "CHIPS award finalised at US$7.86 billion, below the proposed US$8.5 billion",
      "summary": "Intel and the Commerce Department finalised the CHIPS Act award at up to US$7.86 billion in direct\nfunding for the Arizona, New Mexico, Ohio and Oregon projects, reduced from the March preliminary figure.",
      "type": "regulatory",
      "entities": [
        "Intel",
        "U.S. Department of Commerce"
      ],
      "parties": [
        "intel",
        "us-department-of-commerce"
      ],
      "sources": [
        {
          "url": "https://download.intel.com/newsroom/archive/2025/en-us-2024-11-26-intel-biden-harris-administration-finalize-786-billion-funding-award-under-us-chips-act.pdf",
          "outlet": "Intel Newsroom (archive)",
          "published": "2024-11-26",
          "quote": "has awarded Intel up to $7.86 billion in direct funding"
        },
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-chips-act.html",
          "outlet": "Intel Corporation",
          "published": "2024-11-26",
          "quote": "Intel Corporation and the Biden-Harris Administration announced today that the U.S. Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the U.S. CHIPS and Science Act."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 75,
      "url": "https://whatledto.com/events/intel-foundry-18a#n75",
      "date": "2024-09-16",
      "date_precision": "day",
      "title": "Intel Foundry to become an independent subsidiary; AWS signs on for 18A; Germany and Poland paused two years",
      "summary": "After a loss-making quarter and job cuts, Gelsinger said Intel would set up Intel Foundry as an\nindependent subsidiary inside Intel, expand its collaboration with Amazon Web Services including an AI\nfabric chip on 18A, and pause its planned fabs in Germany and Poland by about two years.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Pat Gelsinger",
        "Amazon Web Services"
      ],
      "parties": [
        "intel",
        "pat-gelsinger",
        "amazon-web-services"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/foundry-momentum-progress-plan",
          "outlet": "Intel Newsroom",
          "published": "2024-09-16",
          "quote": "To build on our progress, we plan to establish Intel Foundry as an independent subsidiary inside of Intel."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 74,
      "url": "https://whatledto.com/events/intel-foundry-18a#n74",
      "date": "2024-08-06",
      "date_precision": "day",
      "title": "Intel 18A powers on first client and server chips; PDK 1.0 released to customers",
      "summary": "Intel said the first 18A products, the Panther Lake client chip and Clearwater Forest server chip, had\npowered on and were healthy, that 18A remained on track for production in 2025, and that the 18A Process\nDesign Kit 1.0 had been released in July so outside customers could start designs.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/intel-foundry/intel-foundry-achieves-major-milestones",
          "outlet": "Intel Newsroom",
          "published": "2024-08-06",
          "quote": "Intel 18A powered on and healthy, on track for next-gen client and server chip production next year."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 73,
      "url": "https://whatledto.com/events/intel-foundry-18a#n73",
      "date": "2024-03-20",
      "date_precision": "day",
      "title": "Commerce proposes up to US$8.5 billion in CHIPS Act funding for Intel, plus up to US$11 billion in loans",
      "summary": "Intel and the Biden administration announced preliminary terms for up to US$8.5 billion in direct CHIPS\nAct funding for projects in Arizona, New Mexico, Ohio and Oregon, eligibility for federal loans of up to\nUS$11 billion, and an investment tax credit on more than US$100 billion of qualified investment.",
      "type": "regulatory",
      "entities": [
        "Intel",
        "U.S. Department of Commerce"
      ],
      "parties": [
        "intel",
        "us-department-of-commerce"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-and-biden-admin-announce-up-to-8-5-billion-in-direct-funding-under-the-chips-act",
          "outlet": "Intel Newsroom",
          "published": "2024-03-20",
          "quote": "has proposed up to $8.5 billion in direct funding through the CHIPS and Science Act to advance Intel’s commercial semiconductor projects in Arizona, New Mexico, Ohio and Oregon."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 72,
      "url": "https://whatledto.com/events/intel-foundry-18a#n72",
      "date": "2024-02-21",
      "date_precision": "day",
      "title": "Intel Foundry launched as a systems foundry; Intel 14A unveiled; Microsoft commits a design to 18A",
      "summary": "At its first Foundry Direct Connect event Intel relaunched the business as Intel Foundry, combining\ntechnology development, manufacturing and foundry services, unveiled the 14A node beyond 18A, and had\nMicrosoft CEO Satya Nadella say Microsoft had chosen a design to be built on Intel 18A.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Microsoft",
        "Intel 14A",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "microsoft",
        "intel-14a",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://download.intel.com/newsroom/archive/2025/en-us-2024-02-21-intel-foundry-direct-connect.pdf",
          "outlet": "Intel Newsroom (archive)",
          "published": "2024-02-21",
          "quote": "Intel also unveiled its new process roadmap featuring Intel 14A, an all-new process node, and a range of process node evolutions designed for foundry customers."
        },
        {
          "url": "https://newsroom.intel.com/artificial-intelligence/foundry-news-roadmaps-updates",
          "outlet": "Intel Newsroom",
          "published": "2024-02-21",
          "quote": "During Pat Gelsinger’s keynote, Microsoft Chairman and CEO Satya Nadella stated that Microsoft has chosen a chip design it plans to produce on the Intel 18A process."
        }
      ]
    },
    {
      "timeline": "amd-china-export-controls",
      "id": 552,
      "url": "https://whatledto.com/events/amd-china-export-controls#n552",
      "date": "2023-08-01",
      "date_precision": "day",
      "title": "Lisa Su: China is an 'important' market and AMD sees room for a compliant AI chip",
      "summary": "On the second-quarter 2023 call, as AMD prepared to ramp the MI300, Su said the company would be fully compliant with US export controls but saw an opportunity to develop an accelerator specifically for Chinese customers, following Nvidia's A800 and H800 and Intel's Gaudi variant. That product became the MI308.",
      "type": "announcement",
      "entities": [
        "AMD",
        "Lisa Su",
        "Nvidia",
        "Intel",
        "MI308"
      ],
      "parties": [
        "amd",
        "lisa-su",
        "nvidia",
        "intel",
        "mi308"
      ],
      "sources": [
        {
          "url": "https://www.cnbc.com/2023/08/02/amd-considers-specific-china-ai-chip-to-comply-with-us-export-curbs.html",
          "outlet": "CNBC",
          "published": "2023-08-02",
          "quote": "Lisa Su, CEO of AMD, said on an earnings call late Tuesday that China is an \"important\" market and that the semiconductor giant wants to be fully compliant with U.S. export controls."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 86,
      "url": "https://whatledto.com/events/intel-foundry-18a#n86",
      "date": "2023-06-21",
      "date_precision": "day",
      "title": "Intel sets internal-foundry model for first quarter of 2024",
      "summary": "Intel said a new manufacturing group segment would be included in reportable P&Ls beginning in the first quarter of 2024. The segment would include manufacturing, technology development, and Intel Foundry Services.",
      "type": "financial",
      "entities": [
        "Intel",
        "David Zinsner",
        "Jason Grebe"
      ],
      "parties": [
        "intel",
        "david-zinsner",
        "jason-grebe"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-update-internal-foundry-model.html",
          "outlet": "Intel Newsroom",
          "published": "2023-06-21",
          "quote": "Beginning in Q1 2024, the reportable P&Ls will include a new manufacturing group segment – inclusive of manufacturing, technology development and Intel Foundry Services (IFS) – along with the company’s product groups – Client Computing, Data Center and AI, Network and Edge, and All Other."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 85,
      "url": "https://whatledto.com/events/intel-foundry-18a#n85",
      "date": "2023-06-19",
      "date_precision": "day",
      "title": "Intel and Germany agree expanded Magdeburg fab investment",
      "summary": "Intel and the German federal government signed a revised letter of intent for two fabs in Magdeburg. Intel said the investment was expected to exceed €30 billion and would receive increased government incentives.",
      "type": "announcement",
      "entities": [
        "Intel",
        "German federal government",
        "Magdeburg",
        "Saxony-Anhalt"
      ],
      "parties": [
        "intel",
        "german-federal-government",
        "magdeburg",
        "saxony-anhalt"
      ],
      "sources": [
        {
          "url": "https://newsroom.intel.com/corporate/intel-german-government-agree-magdeburg",
          "outlet": "Intel Newsroom",
          "published": "2023-06-19",
          "quote": "The agreement encompasses Intel’s expanded investment in the site, now expected to be more than 30 billion euros for two first-of-a-kind semiconductor facilities (also known as “fabs”) in Europe, along with increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 84,
      "url": "https://whatledto.com/events/intel-foundry-18a#n84",
      "date": "2021-09-24",
      "date_precision": "day",
      "title": "Intel breaks ground on Fab 52 and Fab 62 in Arizona",
      "summary": "Intel held a groundbreaking ceremony for Fab 52 and Fab 62 at its Ocotillo campus in Chandler, Arizona. Intel put the two-fab project cost at $20 billion.",
      "type": "other",
      "entities": [
        "Intel",
        "Pat Gelsinger",
        "Fab 52",
        "Fab 62",
        "Ocotillo",
        "Chandler",
        "Arizona"
      ],
      "parties": [
        "intel",
        "pat-gelsinger",
        "fab-52",
        "fab-62",
        "ocotillo",
        "chandler",
        "arizona"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/resources/press-kit-intel-builds-arizona.html",
          "outlet": "Intel Newsroom",
          "published": "2024-11-26",
          "quote": "Intel CEO Pat Gelsinger was joined by government and community leaders on Sept. 24, 2021, for a groundbreaking ceremony on the factories: Fab 52 and Fab 62."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 83,
      "url": "https://whatledto.com/events/intel-foundry-18a#n83",
      "date": "2021-08-23",
      "date_precision": "day",
      "title": "Defense Department awards Intel phase-one RAMP-C agreement",
      "summary": "The U.S. Department of Defense awarded Intel an agreement for the first phase of the RAMP-C program. Intel Foundry Services was designated to lead the work.",
      "type": "regulatory",
      "entities": [
        "Intel",
        "U.S. Department of Defense",
        "RAMP-C",
        "NSTXL",
        "S2MARTS"
      ],
      "parties": [
        "intel",
        "us-department-of-defense",
        "ramp-c",
        "nstxl",
        "s2marts"
      ],
      "sources": [
        {
          "url": "https://www.intel.com/content/www/us/en/newsroom/news/intel-wins-us-project-develop-foundry-ecosystem.html",
          "outlet": "Intel Newsroom",
          "published": "2021-08-23",
          "quote": "The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 71,
      "url": "https://whatledto.com/events/intel-foundry-18a#n71",
      "date": "2021-07-26",
      "date_precision": "day",
      "title": "Intel Accelerated: five nodes in four years, ending with Intel 18A in 2025",
      "summary": "Intel published a process roadmap renaming its nodes Intel 7, Intel 4, Intel 3, Intel 20A and Intel 18A,\nintroducing RibbonFET gate-all-around transistors and PowerVia backside power at 20A, and targeting\n18A for 2025, the plan later summarised as five nodes in four years.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Pat Gelsinger",
        "Intel 18A"
      ],
      "parties": [
        "intel",
        "pat-gelsinger",
        "intel-18a"
      ],
      "sources": [
        {
          "url": "https://download.intel.com/newsroom/2021/client-computing/accelerating-process-innovation.pdf",
          "outlet": "Intel Newsroom (fact sheet)",
          "published": "2021-07-26",
          "quote": "Intel today unveiled one of the most detailed process technology roadmaps that the company has ever provided, showcasing breakthrough technologies that will power its products through 2025 and beyond."
        }
      ]
    },
    {
      "timeline": "intel-foundry-18a",
      "id": 70,
      "url": "https://whatledto.com/events/intel-foundry-18a#n70",
      "date": "2021-03-23",
      "date_precision": "day",
      "title": "Gelsinger announces IDM 2.0: two Arizona fabs for about US$20 billion and a standalone Intel Foundry Services",
      "summary": "In his first strategy event as CEO, Pat Gelsinger said Intel would keep manufacturing in house, expand\ncapacity starting with roughly US$20 billion for two new fabs in Arizona, use outside foundries for some\nproducts, and create Intel Foundry Services as a standalone unit to make chips for others.",
      "type": "announcement",
      "entities": [
        "Intel",
        "Pat Gelsinger"
      ],
      "parties": [
        "intel",
        "pat-gelsinger"
      ],
      "sources": [
        {
          "url": "https://www.sec.gov/Archives/edgar/data/50863/000119312521091374/d153275dex991.htm",
          "outlet": "Intel press release (SEC exhibit)",
          "published": "2021-03-23",
          "quote": "Announcing manufacturing expansion plans; beginning with ~$20 billion investment to build two new fabs in Arizona"
        }
      ]
    },
    {
      "timeline": "nvidia-acquisitions",
      "id": 673,
      "url": "https://whatledto.com/events/nvidia-acquisitions#n673",
      "date": "2019-03-11",
      "date_precision": "day",
      "title": "Nvidia agrees to buy Mellanox for $6.9 billion, outbidding Intel for the InfiniBand maker",
      "summary": "Nvidia's first big acquisition, at $125 a share in cash, brought in the Israeli maker of InfiniBand and Ethernet interconnects that already sat inside most of the world's top supercomputers, after reports that Intel and Xilinx had also bid. Jensen Huang framed it as uniting compute and networking for data-center-scale computing; the deal needed approvals in the US, EU, Mexico and China.",
      "type": "announcement",
      "entities": [
        "Nvidia",
        "Mellanox",
        "Jensen Huang",
        "Intel"
      ],
      "parties": [
        "nvidia",
        "mellanox",
        "jensen-huang",
        "intel"
      ],
      "sources": [
        {
          "url": "https://nvidianews.nvidia.com/news/nvidia-to-acquire-mellanox-for-6-9-billion",
          "outlet": "NVIDIA Newsroom",
          "published": "2019-03-11",
          "quote": "NVIDIA and Mellanox today announced that the companies have reached a definitive agreement under which NVIDIA will acquire Mellanox. Pursuant to the agreement, NVIDIA will acquire all of the issued and outstanding common shares of Mellanox for $125 per share in cash, representing a total enterprise value of approximately $6.9 billion."
        }
      ]
    }
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