{ "data_version": "1", "schema": "https://whatledto.com/data", "id": "samsung", "name": "Samsung", "kind": "company", "url": "https://whatledto.com/who/samsung", "description": "Memory maker competing in HBM.", "same_as": [ "https://en.wikipedia.org/wiki/Samsung_Electronics", "https://www.samsung.com/" ], "timelines": [ { "slug": "nvidia-consumer-gpu-dlss", "title": "GeForce and DLSS: From the RTX 50 Launch to 3D-Guided Neural Rendering", "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss", "json": "https://whatledto.com/events/nvidia-consumer-gpu-dlss.json", "role": "Memory supplier cited in reporting on standard RTX 50 2GB GDDR7 supply.", "entries": 1, "updated_at": "2026-10-14T06:38:45.665711+00:00" }, { "slug": "hyperscaler-custom-accelerators", "title": "Custom AI Silicon at the Hyperscalers: TPU, Trainium, Maia, MTIA and the OpenAI–Broadcom Chip", "url": "https://whatledto.com/events/hyperscaler-custom-accelerators", "json": "https://whatledto.com/events/hyperscaler-custom-accelerators.json", "role": "Company named in reports about possible OpenAI chip manufacturing plans.", "entries": 1, "updated_at": "2026-10-14T06:27:24.396104+00:00" }, { "slug": "hbm-memory-supply", "title": "HBM Supply Race: SK hynix, Samsung and Micron from HBM3E to HBM4E", "url": "https://whatledto.com/events/hbm-memory-supply", "json": "https://whatledto.com/events/hbm-memory-supply.json", "role": "HBM supplier that missed the first Nvidia HBM3E wave but announced commercial HBM4 shipments in February 2026 and HBM4E samples in May.", "entries": 12, "updated_at": "2026-10-14T05:44:42.508947+00:00" }, { "slug": "xbox-game-pass", "title": "Xbox Game Pass: The Price Rise, the Reversal and the Metered Cloud", "url": "https://whatledto.com/events/xbox-game-pass", "json": "https://whatledto.com/events/xbox-game-pass.json", "role": "Maker of the 2020 Tizen-based TV sets discussed in the report.", "entries": 1, "updated_at": "2026-10-14T03:03:06.677631+00:00" } ], "entries": [ { "timeline": "hbm-memory-supply", "id": 1912, "url": "https://whatledto.com/events/hbm-memory-supply#n1912", "date": "2026-10-08", "date_precision": "day", "title": "Samsung's quarterly operating profit passes 100 trillion won for the first time, on HBM4", "summary": "Samsung Electronics' preliminary third-quarter 2026 guidance put consolidated operating profit at about 107.4 trillion won, up 782.5 percent year on year, and revenue at about 195 trillion won, up 126.6 percent. TrendForce reported it as a record quarter in which operating profit crossed 100 trillion won for the first time and beat the LSEG SmartEstimate of 106.1 trillion won. It said HBM4 sales began making a meaningful contribution during the quarter, driven by demand for Nvidia's Vera Rubin accelerator, and cited Reuters for Samsung's HBM bit shipments jumping nearly 50 percent quarter on quarter.", "type": "financial", "entities": [ "Samsung", "HBM4", "Nvidia", "Vera Rubin", "TrendForce", "Reuters" ], "parties": [ "samsung", "hbm4", "nvidia", "vera-rubin", "trendforce", "reuters" ], "sources": [ { "url": "https://www.trendforce.com/news/2026/10/08/news-samsung-sees-3q26-operating-profit-soaring-783-to-record-krw-107-4-trillion-on-hbm4-memory-price-gains/", "outlet": "TrendForce", "published": "2026-10-08", "quote": "consolidated operating profit soared 782.5% year over year to KRW 107.4 trillion, while revenue jumped 126.6% to KRW 195 trillion." }, { "url": "https://www.trendforce.com/news/2026/10/08/news-samsung-sees-3q26-operating-profit-soaring-783-to-record-krw-107-4-trillion-on-hbm4-memory-price-gains/", "outlet": "TrendForce", "published": "2026-10-08", "quote": "Fueled by strong HBM4 demand, Samsung’s HBM bit shipments reportedly jumped nearly 50% quarter over quarter in the third quarter, according to Reuters." } ] }, { "timeline": "xbox-game-pass", "id": 1831, "url": "https://whatledto.com/events/xbox-game-pass#n1831", "date": "2026-10-02", "date_precision": "day", "title": "Xbox Cloud Gaming stops supporting Samsung's 2020 Tizen TVs", "summary": "Windows Central reported that Xbox Cloud Gaming was retiring its app on some TV sets and said the cause was the sets themselves: the latest version of the service needs newer Chromium APIs, Samsung has no plans to update its Tizen-based 2020 TVs, and Chromium there has not been updated in almost a decade. Its sources said there were no plans to slow Xbox Cloud Gaming down, and that reports Microsoft had cancelled forthcoming cloud-gaming controllers were false.", "type": "report", "entities": [ "Samsung", "Windows Central" ], "parties": [ "samsung", "windows-central" ], "sources": [ { "url": "https://www.windowscentral.com/gaming/xbox/dark-clouds-appear-over-xbox-cloud-gaming-as-it-retires-apps-on-some-tvs-and-the-reasons-are-poorly-explained", "outlet": "Windows Central", "published": "2026-10-02", "quote": "Samsung has no plans to bring further updates to their Tizen-based 2020 TV sets, and Chromium hasn't been updated there in almost a decade." } ] }, { "timeline": "nvidia-consumer-gpu-dlss", "id": 1514, "url": "https://whatledto.com/events/nvidia-consumer-gpu-dlss#n1514", "date": "2026-09-22", "date_precision": "day", "title": "Reports say Micron moved away from 2GB GDDR7 for RTX 50 cards", "summary": "VideoCardz reported that Micron appeared to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.", "type": "report", "entities": [ "Micron", "GDDR7", "GeForce RTX 50 Series", "GeForce RTX 5060", "Samsung", "SK hynix", "GALAX", "VideoCardz", "Tom’s Hardware" ], "parties": [ "micron", "gddr7", "geforce-rtx-50-series", "geforce-rtx-5060", "samsung", "sk-hynix", "galax", "videocardz", "toms-hardware" ], "sources": [ { "url": "https://videocardz.com/newz/micron-reportedly-ends-production-of-2gb-gddr7-used-by-geforce-rtx-50", "outlet": "VideoCardz", "published": "2026-09-22", "quote": "“Micron appears to be moving away from its 2GB GDDR7 memory chips, including the 28 Gbps part already used on some GeForce RTX 50 graphics cards.”" }, { "url": "https://www.tomshardware.com/pc-components/ram/micron-discontinues-2gb-gddr7-chips-for-gaming-gpus-as-it-pivots-toward-higher-density-memory-for-ai-chipmaker-reportedly-pivots-to-high-margin-3gb-silicon-for-ai-gpus", "outlet": "Tom’s Hardware", "published": "2026-09-24", "quote": "“Tom’s Hardware can confirm that the pages for module norms return ‘No results found.’”" } ] }, { "timeline": "hbm-memory-supply", "id": 1486, "url": "https://whatledto.com/events/hbm-memory-supply#n1486", "date": "2026-09-21", "date_precision": "day", "title": "Report says Samsung reviews 4nm capacity expansion for HBM4 base dies", "summary": "MoneyToday reported that Samsung Electronics was reviewing an expansion of its 4nm foundry-process capacity. The report said the review was to meet growing demand for HBM4 base dies.", "type": "report", "entities": [ "Samsung", "HBM4" ], "parties": [ "samsung", "hbm4" ], "sources": [ { "url": "https://www.mt.co.kr/en/industry/2026/09/22/2026092119545912109", "outlet": "MoneyToday", "published": "2026-09-22", "quote": "According to the electronics industry on the 21st, Samsung Electronics is reviewing an expansion of its foundry 4nm process capacity to meet the growing demand for HBM4 base dies." } ] }, { "timeline": "hbm-memory-supply", "id": 1485, "url": "https://whatledto.com/events/hbm-memory-supply#n1485", "date": "2026-09-20", "date_precision": "day", "title": "Report expects Samsung to more than double HBM4-family output in 2027", "summary": "Seoul Economic Daily reported that Samsung Electronics was expected to more than double output of its HBM4-family chips in 2027. The report included HBM4 and HBM4E in that expectation.", "type": "report", "entities": [ "Samsung", "HBM4", "HBM4E" ], "parties": [ "samsung", "hbm4", "hbm4e" ], "sources": [ { "url": "https://en.sedaily.com/finance/2026/09/20/samsung-to-double-hbm4-output-next-year-sources-say", "outlet": "Seoul Economic Daily", "published": "2026-09-20", "quote": "Samsung Electronics (005930) is expected to more than double output of its HBM4 family of high-bandwidth memory chips next year, including sixth-generation HBM4 and seventh-generation HBM4E, as the company plans to raise demand for glass carriers by 2.5 times from this year." } ] }, { "timeline": "hbm-memory-supply", "id": 1484, "url": "https://whatledto.com/events/hbm-memory-supply#n1484", "date": "2026-09-20", "date_precision": "day", "title": "Report says Samsung HBM4 yield rose to about 80%", "summary": "Seoul Economic Daily reported that Samsung's HBM4 yield was below 60% in the early stages of mass production. The report said the yield had recently climbed to around 80%.", "type": "report", "entities": [ "Samsung", "HBM4" ], "parties": [ "samsung", "hbm4" ], "sources": [ { "url": "https://en.sedaily.com/finance/2026/09/20/samsung-hits-80-percent-yield-on-hbm4-shifts-focus-to-volume", "outlet": "Seoul Economic Daily", "published": "2026-09-20", "quote": "According to industry sources on the 20th, Samsung's HBM4 yield was below 60% in the early stages of mass production but has recently climbed to around 80%." } ] }, { "timeline": "hbm-memory-supply", "id": 1483, "url": "https://whatledto.com/events/hbm-memory-supply#n1483", "date": "2026-09-19", "date_precision": "day", "title": "Samsung directs DDR5 and SSD capacity growth to external firms", "summary": "TechRadar reported that Samsung was directing capacity growth for DDR5 modules and SSDs to external firms. The report said Samsung was reserving in-house capacity for HBM packaging.", "type": "report", "entities": [ "Samsung", "DDR5", "SSD" ], "parties": [ "samsung", "ddr5", "ssd" ], "sources": [ { "url": "https://www.techradar.com/pro/samsung-could-follow-micron-by-outsourcing-ddr5-and-ssd-production-to-third-parties-to-focus-on-more-lucrative-hbm-and-enterprise-products-could-sandisk-follow-suit", "outlet": "TechRadar", "published": "2026-09-19", "quote": "The company is directing capacity growth for DDR5 modules and SSDs toward external firms, reserving its in-house capacity for the more advanced HBM packaging process." } ] }, { "timeline": "hyperscaler-custom-accelerators", "id": 1375, "url": "https://whatledto.com/events/hyperscaler-custom-accelerators#n1375", "date": "2026-09-09", "date_precision": "day", "title": "OpenAI says it did not announce Samsung chip manufacturing plans", "summary": "OpenAI said it had not announced plans to manufacture chips through Samsung Electronics. It said it had nothing new to announce regarding reports about next-generation chips.", "type": "response", "entities": [ "OpenAI", "OpenAI Korea", "Samsung" ], "parties": [ "openai", "openai-korea", "samsung" ], "sources": [ { "url": "https://www.datacenterdynamics.com/en/news/samsung-working-with-openai-on-next-generation-custom-chip-report/", "outlet": "Data Center Dynamics", "published": "2026-09-10", "quote": "We did not announce plans to manufacture chips through Samsung." }, { "url": "https://ca.marketscreener.com/news/openai-says-working-with-samsung-on-next-generation-chips-deepening-cooperation-ce785bd9db8ef123", "outlet": "Reuters via MarketScreener", "published": "2026-09-10", "quote": "We have nothing new to announce on this front." }, { "url": "https://www.marketscreener.com/news/openai-says-working-with-samsung-on-next-generation-chips-deepening-cooperation-ce785bd9db8ef123", "outlet": "Reuters via MarketScreener", "published": "2026-09-09", "quote": "We have nothing new to announce on this front," } ] }, { "timeline": "hbm-memory-supply", "id": 770, "url": "https://whatledto.com/events/hbm-memory-supply#n770", "date": "2026-09-07", "date_precision": "day", "title": "TrendForce links Samsung's Q2 shipment growth to HBM4 ramp", "summary": "TrendForce said Samsung recorded the strongest quarter-on-quarter bit-shipment growth among the three major suppliers in the second quarter of 2026. It attributed the growth to Samsung's early move into HBM4 mass production and shipments.", "type": "report", "entities": [ "Samsung", "SK hynix", "Micron", "TrendForce" ], "parties": [ "samsung", "sk-hynix", "micron", "trendforce" ], "sources": [ { "url": "https://www.trendforce.com/presscenter/news/20260907-13219.html", "outlet": "TrendForce", "published": "2026-09-07", "quote": "TrendForce notes that Samsung posted the strongest QoQ bit shipment growth among the three major suppliers in 2Q26, supported by its early move into HBM4 mass production and shipments." } ] }, { "timeline": "hbm-memory-supply", "id": 149, "url": "https://whatledto.com/events/hbm-memory-supply#n149", "date": "2026-05-29", "date_precision": "day", "title": "Samsung ships the first 12-layer HBM4E samples at up to 16 Gbps", "summary": "Samsung said it had begun shipping 12-layer HBM4E samples to major customers, reaching up to 16 Gbps with\nbetter energy efficiency and thermals, extending its roadmap after the HBM4 mass production earlier in the\nyear.", "type": "announcement", "entities": [ "Samsung", "HBM4E" ], "parties": [ "samsung", "hbm4e" ], "sources": [ { "url": "https://semiconductor.samsung.com/news-events/news/samsung-electronics-begins-shipment-of-industry-first-hbm4e-samples/", "outlet": "Samsung Semiconductor", "published": "2026-05-29", "quote": "Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market." } ] }, { "timeline": "hbm-memory-supply", "id": 148, "url": "https://whatledto.com/events/hbm-memory-supply#n148", "date": "2026-03-16", "date_precision": "day", "title": "Samsung shows HBM4 in mass production for Vera Rubin and unveils HBM4E at GTC 2026", "summary": "At Nvidia's GTC 2026 Samsung made its sixth-generation HBM4, in mass production and designed for the Vera\nRubin platform, the centerpiece of its showcase and unveiled HBM4E, positioning itself as a Nvidia supplier\nafter missing the first HBM3E wave.", "type": "announcement", "entities": [ "Samsung", "Nvidia", "HBM4", "HBM4E" ], "parties": [ "samsung", "nvidia", "hbm4", "hbm4e" ], "sources": [ { "url": "https://semiconductor.samsung.com/news-events/news/samsung-unveils-hbm4e-showcasing-comprehensive-ai-solutions-nvidia-partnership-and-vision-at-nvidia-gtc-2026/", "outlet": "Samsung Semiconductor", "published": "2026-03-16", "quote": "The centerpiece of Samsung’s showcase at NVIDIA GTC 2026 will be the new sixth-generation HBM4, which is now in mass production and is designed for the NVIDIA Vera Rubin platform." } ] }, { "timeline": "hbm-memory-supply", "id": 146, "url": "https://whatledto.com/events/hbm-memory-supply#n146", "date": "2026-02-12", "date_precision": "day", "title": "Samsung begins HBM4 mass production and commercial shipments, expects HBM sales to more than triple in 2026", "summary": "Samsung announced mass production and commercial shipment of HBM4 running at 11.7 Gbps and capable of up\nto 13 Gbps, on a 4nm logic base die, and said it expected its HBM sales to more than triple in 2026 while\nexpanding HBM4 capacity. It was Samsung's first claim of an HBM generation lead over SK hynix.", "type": "launch", "entities": [ "Samsung", "HBM4" ], "parties": [ "samsung", "hbm4" ], "sources": [ { "url": "https://semiconductor.samsung.com/news-events/news/samsung-ships-industry-first-commercial-hbm4-with-ultimate-performance-for-ai-computing/", "outlet": "Samsung Semiconductor", "published": "2026-02-12", "quote": "Samsung anticipates that its HBM sales will more than triple in 2026 compared to 2025, and is proactively expanding its HBM4 production capacity." }, { "url": "https://news.samsung.com/global/samsung-ships-industry-first-commercial-hbm4-with-ultimate-performance-for-ai-computing", "outlet": "Samsung Global Newsroom", "published": "2026-02-12", "quote": "Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers." } ] }, { "timeline": "hbm-memory-supply", "id": 145, "url": "https://whatledto.com/events/hbm-memory-supply#n145", "date": "2026-01-08", "date_precision": "day", "title": "TrendForce: HBM4 mass production slips to the end of the first quarter of 2026 after Nvidia raised the spec", "summary": "TrendForce said HBM4 mass production was now expected no earlier than the end of the first quarter of\n2026, because Nvidia had revised the HBM4 specification for Rubin in the third quarter of 2025 to a per-pin\nspeed above 11 Gbps, forcing all three suppliers to modify designs, and because strong Blackwell demand\nled Nvidia to adjust the Rubin production timeline.", "type": "report", "entities": [ "TrendForce", "Nvidia", "SK hynix", "Samsung", "Micron", "HBM4" ], "parties": [ "trendforce", "nvidia", "sk-hynix", "samsung", "micron", "hbm4" ], "sources": [ { "url": "https://www.trendforce.com/presscenter/news/20260108-12869.html", "outlet": "TrendForce", "published": "2026-01-08", "quote": "Nvidia has revised the HBM4 specifications for its Rubin platform in 3Q25, raising the required per-pin speed to above 11 Gbps. This change has necessitated that the three major HBM suppliers modify their designs." } ] }, { "timeline": "hbm-memory-supply", "id": 152, "url": "https://whatledto.com/events/hbm-memory-supply#n152", "date": "2025-09-24", "date_precision": "day", "title": "Counterpoint reports SK hynix and Samsung held 79% of Q2 HBM shipments", "summary": "Counterpoint Research reported that SK hynix held 62% and Samsung Electronics held 17% of global HBM shipment share in the second quarter of 2025. The reported combined share was about 79%.", "type": "report", "entities": [ "Counterpoint Research", "SK hynix", "Samsung", "HBM" ], "parties": [ "counterpoint-research", "sk-hynix", "samsung", "hbm" ], "sources": [ { "url": "https://korea.counterpointresearch.com/2025-q2-hbm-market-shipments-share/", "outlet": "Counterpoint Research", "published": null, "quote": "2025년 2분기 전세계 HBM 시장에서 SK하이닉스와 삼성전자가 출하량 기준 점유율 62%, 17%를 기록하며, 이로써 K-HBM이 전체 시장의 약 79% 차지" } ] }, { "timeline": "hbm-memory-supply", "id": 136, "url": "https://whatledto.com/events/hbm-memory-supply#n136", "date": "2024-02-27", "date_precision": "day", "title": "Samsung develops the first 12-high 36GB HBM3E, mass production planned for the first half of 2024", "summary": "Samsung announced HBM3E 12H, a 12-stack, 36GB part it called the highest-capacity HBM to date, said it had\nbegun sampling to customers, and targeted mass production in the first half of 2024.", "type": "announcement", "entities": [ "Samsung", "HBM3E" ], "parties": [ "samsung", "hbm3e" ], "sources": [ { "url": "https://semiconductor.samsung.com/news-events/news/samsung-develops-industry-first-36gb-hbm3e-12h-dram/", "outlet": "Samsung Semiconductor", "published": "2024-02-27", "quote": "Samsung has begun sampling its HBM3E 12H to customers and mass production is slated for the first half of this year." } ] } ], "often_with": [ { "id": "nvidia", "name": "Nvidia", "url": "https://whatledto.com/who/nvidia", "json": "https://whatledto.com/who/nvidia.json", "shared_timelines": 4 }, { "id": "sk-hynix", "name": "SK hynix", "url": "https://whatledto.com/who/sk-hynix", "json": "https://whatledto.com/who/sk-hynix.json", "shared_timelines": 2 }, { "id": "amazon", "name": "Amazon", "url": "https://whatledto.com/who/amazon", "json": "https://whatledto.com/who/amazon.json", "shared_timelines": 2 }, { "id": "micron", "name": "Micron", "url": "https://whatledto.com/who/micron", "json": "https://whatledto.com/who/micron.json", "shared_timelines": 2 }, { "id": "microsoft", "name": "Microsoft", "url": "https://whatledto.com/who/microsoft", "json": "https://whatledto.com/who/microsoft.json", "shared_timelines": 2 }, { "id": "amd", "name": "AMD", "url": "https://whatledto.com/who/amd", "json": "https://whatledto.com/who/amd.json", "shared_timelines": 2 }, { "id": "jensen-huang", "name": "Jensen Huang", "url": "https://whatledto.com/who/jensen-huang", "json": "https://whatledto.com/who/jensen-huang.json", "shared_timelines": 1 }, { "id": "toms-hardware", "name": "Tom’s Hardware", "url": "https://whatledto.com/who/toms-hardware", "json": "https://whatledto.com/who/toms-hardware.json", "shared_timelines": 1 } ], "license": { "holder": "What Led To", "terms": "https://whatledto.com/methodology#reuse", "summary": "Quote entries with attribution and a link to the entry; do not republish whole timelines or train models on the text." } }