C.C. Wei

Alongside second-quarter 2026 results, chairman C.C. Wei said TSMC would invest an additional US$100 billion in Arizona to build several more wafer fabs for 2-nanometer and below technologies plus advanced packaging fabs, bringing the state total to US$265 billion. Wei said there was a plan but no firm schedule for the new sites.

On the fourth-quarter 2025 call, TSMC said it was pulling forward existing fab schedules in Taiwan and Arizona, that Arizona yields and defect density were almost equal to Taiwan, and that the plan would scale an independent gigafab cluster in Arizona with around 30 percent of 2nm-and-more-advanced capacity.

On the second-quarter 2025 call, CEO C.C. Wei said construction of the second Arizona fab, for 3nm, was complete and its volume production schedule was being sped up by several quarters. Work on the third fab, for 2nm and A16, had begun. Wei said about 30 percent of TSMC's 2nm-and-smaller capacity would eventually be in Arizona.

Announced at the White House with President Trump, the expansion took TSMC's planned U.S. investment from US$65 billion to US$165 billion, covering three additional fabs, two advanced packaging facilities and a major R&D team center in Arizona.

TSMC said its first Arizona fab entered engineering-wafer production in April using N4 process technology. The statement concerned engineering-wafer production.

TSMC said it had started construction at an Arizona site for a computer-chip factory. The company planned to spend US$12 billion on the facility.